S912ZVMC12F3MKH Tech Spezifikatioune
NXP USA Inc. - S912ZVMC12F3MKH technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - S912ZVMC12F3MKH
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 3.5V ~ 40V | |
Supplier Device Package | 64-HLQFP (10x10) | |
Speed | 50MHz | |
Serie | S12 MagniV | |
RAM Gréisst | 8K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 128KB (128K x 8) | |
Peripheralien | DMA, POR, PWM, WDT | |
Package / Case | 64-LQFP Exposed Pad | |
Package protegéieren | Tray |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 125°C (TA) | |
Zuel vun I / O | 31 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | 512 x 8 | |
Datenkonverter | A/D 9x12b | |
Core Size | 16-Bit | |
Core Prozessor | S12Z | |
Konnektivitéit | CANbus, SCI, SPI | |
Basis Produktnummer | S912 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. S912ZVMC12F3MKH.
Produktiounsattriff | ||||
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Part Number | S912ZVMC12F3MKH | S912ZVMC12F3MKHR | S912ZVMC25F1WKK | S912ZVMC12F1WKH |
Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. |
Peripheralien | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT |
EEPROM Gréisst | 512 x 8 | 512 x 8 | 1K x 8 | 512 x 8 |
Package / Case | 64-LQFP Exposed Pad | 64-LQFP Exposed Pad | 80-LQFP Exposed Pad | 64-LQFP Exposed Pad |
Programmspeichergréisst | 128KB (128K x 8) | 128KB (128K x 8) | 256KB (256K x 8) | 128KB (128K x 8) |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
Oszilléierertyp | Internal | Internal | Internal | Internal |
Basis Produktnummer | S912 | S912 | S912 | S912 |
Core Size | 16-Bit | 16-Bit | 16-Bit | 16-Bit |
Package protegéieren | Tray | Tape & Reel (TR) | Tray | Tray |
Datenkonverter | A/D 9x12b | A/D 9x12b | A/D 16x12b | A/D 9x12b |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Supplier Device Package | 64-HLQFP (10x10) | 64-HLQFP (10x10) | 80-TQFP-EP (12x12) | 64-HLQFP (10x10) |
Operatioun Temperatur | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 150°C (TA) | -40°C ~ 150°C (TA) |
Speed | 50MHz | 50MHz | 50MHz | 50MHz |
RAM Gréisst | 8K x 8 | 8K x 8 | 32K x 8 | 8K x 8 |
Core Prozessor | S12Z | S12Z | S12Z | S12Z |
Zuel vun I / O | 31 | 31 | 31 | 31 |
Serie | S12 MagniV | S12 MagniV | S12 MagniV | S12 MagniV |
Voltage - Versorgung (Vcc / Vdd) | 3.5V ~ 40V | 3.5V ~ 40V | 3.5V ~ 40V | 3.5V ~ 40V |
Konnektivitéit | CANbus, SCI, SPI | CANbus, SCI, SPI | CANbus, SCI, SPI | CANbus, SCI, SPI |
Eroflueden S912ZVMC12F3MKH PDF DataDhusts an NXP USA Inc. Dokumentatioun fir S912ZVMC12F3MKH - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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