MSC8101VT1375F Tech Spezifikatioune
NXP USA Inc. - MSC8101VT1375F technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - MSC8101VT1375F
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | NXP Semiconductors | |
| Voltage - I / O | 3.30V | |
| Voltage - Core | 1.60V | |
| Typ | SC140 Core | |
| Supplier Device Package | 332-FCBGA (17x17) | |
| Serie | StarCore | |
| Package / Case | 332-BFBGA, FCBGA | |
| Package protegéieren | Tray |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Operatioun Temperatur | -40°C ~ 105°C (TJ) | |
| On-Chip RAM | 512kB | |
| Net-Volatile Memory | External | |
| Mounting Type | Surface Mount | |
| Interface | Communications Processor Module (CPM) | |
| Clock Rate | 275MHz | |
| Basis Produktnummer | MSC81 |
| ATTRESSIOUN | BESCHREIWUNG |
|---|---|
| RoHs Status | |
| Fiichtegkeet Sensibilitéitsniveau (MSL) | 3 (168 Hours) |
| Erreecht Status | REACH Unaffected |
| ECCN | 3A001A3 |
| HTSUS | 8542.31.0001 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. MSC8101VT1375F.
| Produktiounsattriff |  |
|
 |
 |
|---|---|---|---|---|
| Part Number | MSC8101VT1375F | MSC8103M1200F | MSC8103M1100F | MSC8122MP8000 |
| Hiersteller | NXP USA Inc. | NXP USA Inc. | Freescale Semiconductor | NXP USA Inc. |
| Voltage - Core | 1.60V | 1.60V | 1.60V | 1.20V |
| Clock Rate | 275MHz | 300MHz | 275MHz | 500MHz |
| Operatioun Temperatur | -40°C ~ 105°C (TJ) | -40°C ~ 75°C (TJ) | -40°C ~ 105°C (TJ) | 0°C ~ 90°C (TJ) |
| On-Chip RAM | 512kB | 512kB | 512kB | 1.436MB |
| Serie | StarCore | StarCore | StarCore | StarCore |
| Net-Volatile Memory | External | External | External | External |
| Basis Produktnummer | MSC81 | MSC81 | MSC81 | MSC81 |
| Package / Case | 332-BFBGA, FCBGA | 332-BFBGA, FCBGA | 332-BFBGA, FCBGA | 431-BFBGA, FCBGA |
| Typ | SC140 Core | SC140 Core | SC140 Core | SC140 Core |
| Interface | Communications Processor Module (CPM) | Communications Processor Module (CPM) | Communications Processor Module (CPM) | DSI, Ethernet, RS-232 |
| Supplier Device Package | 332-FCBGA (17x17) | 332-FCBGA (17x17) | 332-FCBGA (17x17) | 431-FCPBGA (20x20) |
| Package protegéieren | Tray | Tray | Bulk | Tray |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Voltage - I / O | 3.30V | 3.30V | 3.30V | 3.30V |
Eroflueden MSC8101VT1375F PDF DataDhusts an NXP USA Inc. Dokumentatioun fir MSC8101VT1375F - NXP USA Inc..
MSC8122TMP6400VFreescale SemiconductorMSC8103M1200FNXP USA Inc.DSP 16BIT 300MHZ CPM 332FCBGA
MSC808N/AMSC8103M1100FFreescale SemiconductorDSP, 16 BIT SIZE, 64-EXT BIT, 68MSC8122MP8000NXP USA Inc.DSP 16BIT 500MHZ MULTI 431FCBGAMSC8103M1100FNXP USA Inc.DSP 16BIT 275MHZ CPM 332FCBGAMSC8102M4400Freescale / NXP SemiconductorsMSC8122TVT4800VFreescale SemiconductorDIGITAL SIGNAL PROCESSOR, 16-BITMSC8101M1250CFreescale / NXP Semiconductors
MSC750SMA170BMicrochipMSC8122TMP6400NXP USA Inc.DSP 16BIT 400MHZ MULTI 431FCBGAMSC8101M1250FNXP USA Inc.DSP 16BIT 250MHZ CPM 332FCBGAMSC80197ASIMSC8101M1250FMotorolaDSP, 16 BIT SIZE, 64-EXT BIT, 62MSC7170-08GS-BKOKISEMICONDUCTORMSC8122TVT4800VNXP USA Inc.IC DSP QUAD 16B 300MHZ 431FCBGAMSC8101M1375FNXP USA Inc.DSP 16BIT 275MHZ CPM 332FCBGAMSC750SMA170SMicrochip| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
Wëllt Dir e bessere Präis? ARA AAA A WED : Mir kontaktéieren Iech direkt.