MKL03Z32CBF4R Tech Spezifikatioune
NXP USA Inc. - MKL03Z32CBF4R technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - MKL03Z32CBF4R
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 1.71V ~ 3.6V | |
Supplier Device Package | 20-WLCSP (2x1.61) | |
Speed | 48MHz | |
Serie | Kinetis KL03 | |
RAM Gréisst | 2K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 32KB (32K x 8) | |
Peripheralien | Brown-out Detect/Reset, LVD, POR, PWM, WDT | |
Package / Case | 20-XFBGA, WLCSP |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Package protegéieren | Tape & Reel (TR) | |
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 85°C (TA) | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | - | |
Core Size | 32-Bit Single-Core | |
Core Prozessor | ARM® Cortex®-M0+ | |
Konnektivitéit | I²C, SPI, UART/USART | |
Basis Produktnummer | MKL03Z32 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. MKL03Z32CBF4R.
Produktiounsattriff | ||||
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Part Number | MKL03Z32CBF4R | MKL03Z32VFK4R | MKL02Z32VFM4 | MKL03Z8VFK4 |
Hiersteller | NXP USA Inc. | NXP USA Inc. | Freescale Semiconductor | Freescale Semiconductor |
Oszilléierertyp | Internal | Internal | Internal | Internal |
EEPROM Gréisst | - | - | - | - |
Basis Produktnummer | MKL03Z32 | MKL03Z32 | MKL02Z32 | MKL03Z8 |
Core Size | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core |
Package / Case | 20-XFBGA, WLCSP | 24-VFQFN Exposed Pad | 32-VFQFN Exposed Pad | 24-UFQFN Exposed Pad |
Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Bulk | Bulk |
RAM Gréisst | 2K x 8 | 2K x 8 | 4K x 8 | 2K x 8 |
Programmspeichergréisst | 32KB (32K x 8) | 32KB (32K x 8) | 32KB (32K x 8) | 8KB (8K x 8) |
Peripheralien | Brown-out Detect/Reset, LVD, POR, PWM, WDT | Brown-out Detect/Reset, LVD, POR, PWM, WDT | Brown-out Detect/Reset, LVD, POR, PWM, WDT | Brown-out Detect/Reset, LVD, POR, PWM, WDT |
Mounting Type | Surface Mount | Surface Mount | Surface Mount, Wettable Flank | Surface Mount |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
Supplier Device Package | 20-WLCSP (2x1.61) | 24-QFN (4x4) | 32-HVQFN (5x5) | 24-QFN (4x4) |
Konnektivitéit | I²C, SPI, UART/USART | I²C, SPI, UART/USART | I²C, SPI, UART/USART | I²C, SPI, UART/USART |
Core Prozessor | ARM® Cortex®-M0+ | ARM® Cortex®-M0+ | ARM® Cortex®-M0+ | ARM® Cortex®-M0+ |
Voltage - Versorgung (Vcc / Vdd) | 1.71V ~ 3.6V | 1.71V ~ 3.6V | 1.71V ~ 3.6V | 1.71V ~ 3.6V |
Serie | Kinetis KL03 | Kinetis KL03 | Kinetis KL02 | Kinetis KL03 |
Speed | 48MHz | 48MHz | 48MHz | 48MHz |
Eroflueden MKL03Z32CBF4R PDF DataDhusts an NXP USA Inc. Dokumentatioun fir MKL03Z32CBF4R - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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