MK10DN512VMD10 Tech Spezifikatioune
NXP USA Inc. - MK10DN512VMD10 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - MK10DN512VMD10
Produktiounsattriff | Attributer Wäert | |
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Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 1.71V ~ 3.6V | |
Supplier Device Package | 144-MAPBGA (13x13) | |
Speed | 100MHz | |
Serie | Kinetis K10 | |
RAM Gréisst | 128K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 512KB (512K x 8) | |
Peripheralien | DMA, I²S, LVD, POR, PWM, WDT | |
Package / Case | 144-LBGA | |
Package protegéieren | Tray |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 105°C (TA) | |
Zuel vun I / O | 104 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | - | |
Datenkonverter | A/D 46x16b; D/A 2x12b | |
Core Size | 32-Bit Single-Core | |
Core Prozessor | ARM® Cortex®-M4 | |
Konnektivitéit | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | |
Basis Produktnummer | MK10DN512 |
ATTRESSIOUN | BESCHREIWUNG |
---|---|
RoHs Status | |
Fiichtegkeet Sensibilitéitsniveau (MSL) | 3 (168 Hours) |
Erreecht Status | REACH Unaffected |
ECCN | 3A991A2 |
HTSUS | 8542.31.0001 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. MK10DN512VMD10.
Produktiounsattriff | ||||
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Part Number | MK10DN512VMD10 | MK10DN512VLL10 | MK10DN512ZVMD10 | MK10DN64VFM5 |
Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. |
Package protegéieren | Tray | Tray | Tray | Tray |
Basis Produktnummer | MK10DN512 | MK10DN512 | MK10DN512 | MK10DN64 |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
Voltage - Versorgung (Vcc / Vdd) | 1.71V ~ 3.6V | 1.71V ~ 3.6V | 1.71V ~ 3.6V | 1.71V ~ 3.6V |
Peripheralien | DMA, I²S, LVD, POR, PWM, WDT | DMA, I²S, LVD, POR, PWM, WDT | DMA, I²S, LVD, POR, PWM, WDT | DMA, I²S, LVD, POR, PWM, WDT |
RAM Gréisst | 128K x 8 | 128K x 8 | 128K x 8 | 16K x 8 |
Operatioun Temperatur | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
Serie | Kinetis K10 | Kinetis K10 | Kinetis K10 | Kinetis K10 |
Konnektivitéit | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | I²C, IrDA, SPI, UART/USART |
Datenkonverter | A/D 46x16b; D/A 2x12b | A/D 37x16b; D/A 1x12b | A/D 46x16b; D/A 2x12b | A/D 10x16b |
Speed | 100MHz | 100MHz | 100MHz | 50MHz |
Core Size | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core |
Oszilléierertyp | Internal | Internal | Internal | Internal |
EEPROM Gréisst | - | - | - | - |
Supplier Device Package | 144-MAPBGA (13x13) | 100-LQFP (14x14) | 144-MAPBGA (13x13) | 32-HVQFN (5x5) |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount, Wettable Flank |
Programmspeichergréisst | 512KB (512K x 8) | 512KB (512K x 8) | 512KB (512K x 8) | 64KB (64K x 8) |
Zuel vun I / O | 104 | 70 | 104 | 24 |
Package / Case | 144-LBGA | 100-LQFP | 144-LBGA | 32-VFQFN Exposed Pad |
Core Prozessor | ARM® Cortex®-M4 | ARM® Cortex®-M4 | ARM® Cortex®-M4 | ARM® Cortex®-M4 |
Eroflueden MK10DN512VMD10 PDF DataDhusts an NXP USA Inc. Dokumentatioun fir MK10DN512VMD10 - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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