MCF52210CEP66 Tech Spezifikatioune
NXP USA Inc. - MCF52210CEP66 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - MCF52210CEP66
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | NXP Semiconductors | |
| Voltage - Versorgung (Vcc / Vdd) | 3V ~ 3.6V | |
| Supplier Device Package | 64-QFN-EP (9x9) | |
| Speed | 66MHz | |
| Serie | MCF5221x | |
| RAM Gréisst | 16K x 8 | |
| Programm Memory Type | FLASH | |
| Programmspeichergréisst | 64KB (64K x 8) | |
| Peripheralien | DMA, LVD, POR, PWM, WDT | |
| Package / Case | 64-VFQFN Exposed Pad | |
| Package protegéieren | Box |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Oszilléierertyp | Internal | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | |
| Zuel vun I / O | 43 | |
| Mounting Type | Surface Mount | |
| EEPROM Gréisst | - | |
| Datenkonverter | A/D 8x12b | |
| Core Size | 32-Bit Single-Core | |
| Core Prozessor | Coldfire V2 | |
| Konnektivitéit | I²C, SPI, UART/USART, USB OTG | |
| Basis Produktnummer | MCF52210 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. MCF52210CEP66.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | MCF52210CEP66 | MCF5216CVM66 | MCF5216CVF66 | MCF52211CEP66 |
| Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | Freescale Semiconductor |
| Programmspeichergréisst | 64KB (64K x 8) | 512KB (512K x 8) | 512KB (512K x 8) | 128KB (128K x 8) |
| Core Size | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core |
| Konnektivitéit | I²C, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, I²C, SPI, UART/USART | CANbus, EBI/EMI, I²C, SPI, UART/USART | I²C, SPI, UART/USART, USB OTG |
| EEPROM Gréisst | - | - | - | - |
| Oszilléierertyp | Internal | Internal | Internal | Internal |
| Voltage - Versorgung (Vcc / Vdd) | 3V ~ 3.6V | 2.7V ~ 3.6V | 2.7V ~ 3.6V | 3V ~ 3.6V |
| Package protegéieren | Box | Tray | Tray | Bulk |
| Speed | 66MHz | 66MHz | 66MHz | 66MHz |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Zuel vun I / O | 43 | 142 | 142 | 43 |
| Peripheralien | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT |
| RAM Gréisst | 16K x 8 | 64K x 8 | 64K x 8 | 16K x 8 |
| Datenkonverter | A/D 8x12b | A/D 8x12b | A/D 8x12b | A/D 8x12b |
| Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
| Package / Case | 64-VFQFN Exposed Pad | 256-LBGA | 256-LBGA | 64-VFQFN Exposed Pad |
| Supplier Device Package | 64-QFN-EP (9x9) | 256-MAPBGA (17x17) | 256-MAPBGA (17x17) | 64-QFN-EP (9x9) |
| Basis Produktnummer | MCF52210 | MCF5216 | MCF5216 | MCF52211 |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Serie | MCF5221x | MCF521x | MCF521x | MCF5221x |
| Core Prozessor | Coldfire V2 | Coldfire V2 | Coldfire V2 | Coldfire V2 |
Eroflueden MCF52210CEP66 PDF DataDhusts an NXP USA Inc. Dokumentatioun fir MCF52210CEP66 - NXP USA Inc..
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|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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