MCF5208CAB166 Tech Spezifikatioune
NXP USA Inc. - MCF5208CAB166 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - MCF5208CAB166
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | NXP Semiconductors | |
| Voltage - Versorgung (Vcc / Vdd) | 1.4V ~ 3.6V | |
| Supplier Device Package | 160-QFP (28x28) | |
| Speed | 166.67MHz | |
| Serie | MCF520x | |
| RAM Gréisst | 16K x 8 | |
| Programm Memory Type | ROMless | |
| Programmspeichergréisst | - | |
| Peripheralien | DMA, WDT | |
| Package / Case | 160-BQFP | |
| Package protegéieren | Tray |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Oszilléierertyp | External | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | |
| Zuel vun I / O | 50 | |
| Mounting Type | Surface Mount | |
| EEPROM Gréisst | - | |
| Datenkonverter | - | |
| Core Size | 32-Bit Single-Core | |
| Core Prozessor | Coldfire V2 | |
| Konnektivitéit | EBI/EMI, Ethernet, I²C, SPI, UART/USART | |
| Basis Produktnummer | MCF5208 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. MCF5208CAB166.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | MCF5208CAB166 | MCF52100CEP66 | MCF5207CVM166 | MCF5208CVM166 |
| Hiersteller | NXP USA Inc. | NXP USA Inc. | Freescale Semiconductor | NXP USA Inc. |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Peripheralien | DMA, WDT | DMA, LVD, POR, PWM, WDT | DMA, WDT | DMA, WDT |
| EEPROM Gréisst | - | - | - | - |
| Package protegéieren | Tray | Tray | Bulk | Tray |
| Zuel vun I / O | 50 | 43 | 30 | 50 |
| Core Size | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core |
| Package / Case | 160-BQFP | 64-VFQFN Exposed Pad | 144-LBGA | 196-LBGA |
| Programmspeichergréisst | - | 64KB (64K x 8) | - | - |
| Datenkonverter | - | A/D 8x12b | - | - |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Voltage - Versorgung (Vcc / Vdd) | 1.4V ~ 3.6V | 3V ~ 3.6V | 1.4V ~ 3.6V | 1.4V ~ 3.6V |
| RAM Gréisst | 16K x 8 | 16K x 8 | 16K x 8 | 16K x 8 |
| Basis Produktnummer | MCF5208 | MCF52100 | MCF5207 | MCF5208 |
| Supplier Device Package | 160-QFP (28x28) | 64-QFN-EP (9x9) | 144-MAPBGA (13x13) | 196-LBGA (15x15) |
| Konnektivitéit | EBI/EMI, Ethernet, I²C, SPI, UART/USART | I²C, SPI, UART/USART | EBI/EMI, I²C, SPI, UART/USART | EBI/EMI, Ethernet, I²C, SPI, UART/USART |
| Oszilléierertyp | External | Internal | External | External |
| Serie | MCF520x | MCF521xx | MCF520x | MCF520x |
| Core Prozessor | Coldfire V2 | Coldfire V2 | Coldfire V2 | Coldfire V2 |
| Speed | 166.67MHz | 66MHz | 166.67MHz | 166.67MHz |
| Programm Memory Type | ROMless | FLASH | ROMless | ROMless |
Eroflueden MCF5208CAB166 PDF DataDhusts an NXP USA Inc. Dokumentatioun fir MCF5208CAB166 - NXP USA Inc..
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|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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