MC9S08QG8CPBE Tech Spezifikatioune
NXP USA Inc. - MC9S08QG8CPBE technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - MC9S08QG8CPBE
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 1.8V ~ 3.6V | |
Supplier Device Package | 16-PDIP | |
Speed | 20MHz | |
Serie | S08 | |
RAM Gréisst | 512 x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 8KB (8K x 8) | |
Peripheralien | LVD, POR, PWM, WDT | |
Package / Case | 16-DIP (0.300', 7.62mm) | |
Package protegéieren | Tube |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 85°C (TA) | |
Zuel vun I / O | 12 | |
Mounting Type | Through Hole | |
EEPROM Gréisst | - | |
Datenkonverter | A/D 8x10b | |
Core Size | 8-Bit | |
Core Prozessor | S08 | |
Konnektivitéit | I²C, SCI, SPI | |
Basis Produktnummer | MC9S08 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. MC9S08QG8CPBE.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | MC9S08QG8CPBE | MC9S08RD16DWE | MC9S08QG8CDTER | MC9S08QG8CFFE |
Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. |
EEPROM Gréisst | - | - | - | - |
Basis Produktnummer | MC9S08 | MC9S08 | MC9S08 | MC9S08 |
RAM Gréisst | 512 x 8 | 1K x 8 | 512 x 8 | 512 x 8 |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
Serie | S08 | S08 | S08 | S08 |
Package protegéieren | Tube | Tube | Tape & Reel (TR) | Tray |
Supplier Device Package | 16-PDIP | 28-SOIC | 16-TSSOP | 16-QFN-EP (5x5) |
Peripheralien | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT |
Zuel vun I / O | 12 | 23 | 12 | 12 |
Voltage - Versorgung (Vcc / Vdd) | 1.8V ~ 3.6V | 1.8V ~ 3.6V | 1.8V ~ 3.6V | 1.8V ~ 3.6V |
Operatioun Temperatur | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
Programmspeichergréisst | 8KB (8K x 8) | 16KB (16K x 8) | 8KB (8K x 8) | 8KB (8K x 8) |
Speed | 20MHz | 8MHz | 20MHz | 20MHz |
Oszilléierertyp | Internal | Internal | Internal | Internal |
Konnektivitéit | I²C, SCI, SPI | SCI | I²C, SCI, SPI | I²C, SCI, SPI |
Package / Case | 16-DIP (0.300', 7.62mm) | 28-SOIC (0.295', 7.50mm Width) | 16-TSSOP (0.173', 4.40mm Width) | 16-VQFN Exposed Pad |
Mounting Type | Through Hole | Surface Mount | Surface Mount | Surface Mount |
Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
Datenkonverter | A/D 8x10b | - | A/D 8x10b | A/D 8x10b |
Core Prozessor | S08 | S08 | S08 | S08 |
Eroflueden MC9S08QG8CPBE PDF DataDhusts an NXP USA Inc. Dokumentatioun fir MC9S08QG8CPBE - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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