MC9S08GT60ACFDE Tech Spezifikatioune
NXP USA Inc. - MC9S08GT60ACFDE technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - MC9S08GT60ACFDE
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 1.8V ~ 3.6V | |
Supplier Device Package | 48-QFN-EP (7x7) | |
Speed | 40MHz | |
Serie | S08 | |
RAM Gréisst | 4K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 60KB (60K x 8) | |
Peripheralien | LVD, POR, PWM, WDT | |
Package / Case | 48-VFQFN Exposed Pad | |
Package protegéieren | Tray |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 85°C (TA) | |
Zuel vun I / O | 39 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | - | |
Datenkonverter | A/D 8x10b | |
Core Size | 8-Bit | |
Core Prozessor | S08 | |
Konnektivitéit | I²C, SCI, SPI | |
Basis Produktnummer | MC9S08 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. MC9S08GT60ACFDE.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | MC9S08GT60ACFDE | MC9S08GT60ACBE | MC9S08GT60ACFBE | MC9S08GT60CFD |
Hiersteller | NXP USA Inc. | NXP USA Inc. | Freescale Semiconductor | NXP USA Inc. |
Voltage - Versorgung (Vcc / Vdd) | 1.8V ~ 3.6V | 1.8V ~ 3.6V | - | 1.8V ~ 3.6V |
Package / Case | 48-VFQFN Exposed Pad | 42-SDIP (0.600", 15.24mm) | - | 48-VFQFN Exposed Pad |
Programm Memory Type | FLASH | FLASH | - | FLASH |
Core Prozessor | S08 | S08 | - | S08 |
Oszilléierertyp | Internal | Internal | - | Internal |
Programmspeichergréisst | 60KB (60K x 8) | 60KB (60K x 8) | - | 60KB (60K x 8) |
RAM Gréisst | 4K x 8 | 4K x 8 | - | 4K x 8 |
EEPROM Gréisst | - | - | - | - |
Core Size | 8-Bit | 8-Bit | - | 8-Bit |
Basis Produktnummer | MC9S08 | MC9S08 | MC9S08 | MC9S08 |
Zuel vun I / O | 39 | 33 | - | 39 |
Datenkonverter | A/D 8x10b | A/D 8x10b | - | A/D 8x10b |
Konnektivitéit | I²C, SCI, SPI | I²C, SCI, SPI | - | I²C, SCI, SPI |
Mounting Type | Surface Mount | Through Hole | - | Surface Mount |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | - | -40°C ~ 85°C (TA) |
Peripheralien | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | - | LVD, POR, PWM, WDT |
Package protegéieren | Tray | Tube | Bulk | Tray |
Speed | 40MHz | 40MHz | - | 40MHz |
Serie | S08 | S08 | * | S08 |
Supplier Device Package | 48-QFN-EP (7x7) | 42-PDIP | - | 48-QFN-EP (7x7) |
Eroflueden MC9S08GT60ACFDE PDF DataDhusts an NXP USA Inc. Dokumentatioun fir MC9S08GT60ACFDE - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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