MC9S08FL16CLC Tech Spezifikatioune
NXP USA Inc. - MC9S08FL16CLC technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - MC9S08FL16CLC
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 4.5V ~ 5.5V | |
Supplier Device Package | 32-LQFP (7x7) | |
Speed | 20MHz | |
Serie | S08 | |
RAM Gréisst | 1K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 16KB (16K x 8) | |
Peripheralien | LVD, PWM, WDT | |
Package / Case | 32-LQFP | |
Package protegéieren | Tray |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 85°C (TA) | |
Zuel vun I / O | 30 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | - | |
Datenkonverter | A/D 12x8b | |
Core Size | 8-Bit | |
Core Prozessor | S08 | |
Konnektivitéit | SCI | |
Basis Produktnummer | MC9S08 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. MC9S08FL16CLC.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | MC9S08FL16CLC | MC9S08GB32CFUE | MC9S08GB32ACFUE | MC9S08FL8CBM |
Hiersteller | NXP USA Inc. | NXP USA Inc. | Freescale Semiconductor | NXP USA Inc. |
Package protegéieren | Tray | Tray | Bulk | Tube |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Through Hole |
Core Prozessor | S08 | S08 | S08 | S08 |
Voltage - Versorgung (Vcc / Vdd) | 4.5V ~ 5.5V | 1.8V ~ 3.6V | 1.8V ~ 3.6V | 4.5V ~ 5.5V |
Supplier Device Package | 32-LQFP (7x7) | 64-LQFP (10x10) | 64-LQFP (10x10) | 32-SDIP |
Datenkonverter | A/D 12x8b | A/D 8x10b | A/D 8x10b | A/D 12x8b |
Basis Produktnummer | MC9S08 | MC9S08 | MC9S08 | MC9S08 |
Programmspeichergréisst | 16KB (16K x 8) | 32KB (32K x 8) | 32KB (32K x 8) | 8KB (8K x 8) |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
Package / Case | 32-LQFP | 64-LQFP | 64-LQFP | 32-SDIP (0.400", 10.16mm) |
Konnektivitéit | SCI | I²C, SCI, SPI | I²C, SCI, SPI | SCI |
EEPROM Gréisst | - | - | - | - |
Oszilléierertyp | Internal | Internal | Internal | Internal |
RAM Gréisst | 1K x 8 | 2K x 8 | 2K x 8 | 768 x 8 |
Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
Zuel vun I / O | 30 | 56 | 56 | 30 |
Serie | S08 | S08 | S08 | S08 |
Speed | 20MHz | 40MHz | 40MHz | 20MHz |
Peripheralien | LVD, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, PWM, WDT |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
Eroflueden MC9S08FL16CLC PDF DataDhusts an NXP USA Inc. Dokumentatioun fir MC9S08FL16CLC - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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