LPC824M201JHI33Y Tech Spezifikatioune
NXP USA Inc. - LPC824M201JHI33Y technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - LPC824M201JHI33Y
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | NXP Semiconductors | |
| Voltage - Versorgung (Vcc / Vdd) | 1.8V ~ 3.6V | |
| Supplier Device Package | 32-HVQFN (5x5) | |
| Speed | 30MHz | |
| Serie | LPC82x | |
| RAM Gréisst | 8K x 8 | |
| Programm Memory Type | FLASH | |
| Programmspeichergréisst | 32KB (32K x 8) | |
| Peripheralien | Brown-out Detect/Reset, DMA, POR, PWM, WDT | |
| Package / Case | 32-VFQFN Exposed Pad | |
| Package protegéieren | Tape & Reel (TR) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Oszilléierertyp | Internal | |
| Operatioun Temperatur | -40°C ~ 105°C (TA) | |
| Zuel vun I / O | 29 | |
| Mounting Type | Surface Mount | |
| EEPROM Gréisst | - | |
| Datenkonverter | A/D 12x12b | |
| Core Size | 32-Bit Single-Core | |
| Core Prozessor | ARM® Cortex®-M0+ | |
| Konnektivitéit | I²C, SPI, UART/USART | |
| Basis Produktnummer | LPC824 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. LPC824M201JHI33Y.
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|---|---|---|---|---|
| Part Number | LPC824M201JHI33Y | LPC824M201JHI33K | LPC822M101JHI33Y | LPC844M201JHI48E |
| Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. |
| Operatioun Temperatur | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
| EEPROM Gréisst | - | - | - | - |
| Oszilléierertyp | Internal | Internal | Internal | External, Internal |
| Konnektivitéit | I²C, SPI, UART/USART | I²C, SPI, UART/USART | I²C, SPI, UART/USART | I²C, SPI, UART/USART |
| Package protegéieren | Tape & Reel (TR) | Tray | Tape & Reel (TR) | Tray |
| Serie | LPC82x | LPC82x | LPC82x | LPC84x |
| Supplier Device Package | 32-HVQFN (5x5) | 32-HVQFN (5x5) | 32-HVQFN (5x5) | 48-HVQFN (7x7) |
| Core Size | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core |
| Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
| Speed | 30MHz | 30MHz | 30MHz | 30MHz |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | 32-VFQFN Exposed Pad | 32-VFQFN Exposed Pad | 32-VFQFN Exposed Pad | 48-VFQFN Exposed Pad |
| Peripheralien | Brown-out Detect/Reset, DMA, POR, PWM, WDT | Brown-out Detect/Reset, DMA, POR, PWM, WDT | Brown-out Detect/Reset, DMA, POR, PWM, WDT | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| Voltage - Versorgung (Vcc / Vdd) | 1.8V ~ 3.6V | 1.8V ~ 3.6V | 1.8V ~ 3.6V | 1.8V ~ 3.6V |
| Programmspeichergréisst | 32KB (32K x 8) | 32KB (32K x 8) | 16KB (16K x 8) | 64KB (64K x 8) |
| Datenkonverter | A/D 12x12b | A/D 12x12b | A/D 12x12b | A/D 12x12b |
| Basis Produktnummer | LPC824 | LPC824 | LPC822 | LPC844 |
| Zuel vun I / O | 29 | 29 | 29 | 42 |
| RAM Gréisst | 8K x 8 | 8K x 8 | 4K x 8 | 8K x 8 |
| Core Prozessor | ARM® Cortex®-M0+ | ARM® Cortex®-M0+ | ARM® Cortex®-M0+ | ARM® Cortex®-M0+ |
Eroflueden LPC824M201JHI33Y PDF DataDhusts an NXP USA Inc. Dokumentatioun fir LPC824M201JHI33Y - NXP USA Inc..
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LPC824M201JDH20JNXP USA Inc.IC MCU 32BIT 32KB FLASH 20TSSOPLPC845M301JBD48ENXP SemiconductorsLPC824M201JHI33ENXP USA Inc.IC MCU 32BIT 32KB FLASH 32HVQFNLPC824M201JH33Freescale / NXP Semiconductors| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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