LPC2364HBD100 Tech Spezifikatioune
NXP USA Inc. - LPC2364HBD100 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - LPC2364HBD100
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | FLASH | |
Voltage - Breakdown | 100-LQFP (14x14) | |
Serie | LPC2300 | |
RoHS Status | Tray | |
Reverse Recovery Time (trr) | 72MHz | |
Erfuerderlech | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | |
Programm Memory Type | 128KB (128K x 8) | |
Programmspeichergréisst | CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB | |
Polarisatioun | 100-LQFP | |
Oszilléierertyp | A/D 6x10b; D/A 1x10b | |
Operatioun Temperatur | -40°C ~ 125°C (TA) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Betribssystem | ARM7® | |
Feuchtigkeit Sensibilitéitniveau (MSL) | 3 (168 Hours) | |
Fabrik Standard Lead Time | 12 Weeks | |
Hiersteller | LPC2364HBD100 | |
Expanded Description | ARM7® LPC2300 Microcontroller IC 16/32-Bit 72MHz 128KB (128K x 8) FLASH 100-LQFP (14x14) | |
Beschreiwung | IC MCU 32BIT 128KB FLASH 100LQFP | |
Dat SRAM Bytes | - | |
Datenkonverter | 3 V ~ 3.6 V | |
Core Size | 34K x 8 | |
Controller-Serie | Internal | |
Konnektivitéit | 16/32-Bit | |
Clock Rate | 70 |
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Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | LPC2364HBD100 | LPC2364FBD100K | LPC2366FBD100K | LPC2367FBD100 |
Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | Freescale / NXP Semiconductors |
Reverse Recovery Time (trr) | 72MHz | - | - | - |
Konnektivitéit | 16/32-Bit | CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB | CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB | - |
Beschreiwung | IC MCU 32BIT 128KB FLASH 100LQFP | - | - | - |
Erfuerderlech | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | - | - | - |
Voltage - Breakdown | 100-LQFP (14x14) | - | - | - |
Core Size | 34K x 8 | 16/32-Bit | 16/32-Bit | - |
Datenkonverter | 3 V ~ 3.6 V | A/D 6x10b SAR; D/A 1x10b | A/D 6x10b SAR; D/A 1x10b | - |
Dat SRAM Bytes | - | - | - | - |
RoHS Status | Tray | - | - | - |
Programm Memory Type | 128KB (128K x 8) | FLASH | FLASH | - |
Feuchtigkeit Sensibilitéitniveau (MSL) | 3 (168 Hours) | - | - | - |
Clock Rate | 70 | - | - | - |
Betribssystem | ARM7® | - | - | - |
Fabrik Standard Lead Time | 12 Weeks | - | - | - |
Expanded Description | ARM7® LPC2300 Microcontroller IC 16/32-Bit 72MHz 128KB (128K x 8) FLASH 100-LQFP (14x14) | - | - | - |
Voltage - Versorgung (Vcc / Vdd) | FLASH | 3V ~ 3.6V | 3V ~ 3.6V | - |
Polarisatioun | 100-LQFP | - | - | - |
Oszilléierertyp | A/D 6x10b; D/A 1x10b | Internal | Internal | - |
Programmspeichergréisst | CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB | 128KB (128K x 8) | 256KB (256K x 8) | - |
Operatioun Temperatur | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | - |
Controller-Serie | Internal | - | - | - |
Serie | LPC2300 | LPC2300 | LPC2300 | - |
Hiersteller | LPC2364HBD100 | - | - | - |
Eroflueden LPC2364HBD100 PDF DataDhusts an NXP USA Inc. Dokumentatioun fir LPC2364HBD100 - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
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DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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