LPC1857JBD208E Tech Spezifikatioune
NXP USA Inc. - LPC1857JBD208E technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - LPC1857JBD208E
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 2.2V ~ 3.6V | |
Supplier Device Package | 208-LQFP (28x28) | |
Speed | 180MHz | |
Serie | LPC18xx | |
RAM Gréisst | 136K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 1MB (1M x 8) | |
Peripheralien | Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT | |
Package / Case | 208-LQFP | |
Package protegéieren | Tray |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 105°C (TA) | |
Zuel vun I / O | 142 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | 16K x 8 | |
Datenkonverter | A/D 8x10b; D/A 1x10b | |
Core Size | 32-Bit Single-Core | |
Core Prozessor | ARM® Cortex®-M3 | |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | |
Basis Produktnummer | LPC1857 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. LPC1857JBD208E.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | LPC1857JBD208E | LPC18S50FET180E | LPC1857FET256551 | LPC18B1UK |
Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP Semiconductors | Freescale / NXP Semiconductors |
EEPROM Gréisst | 16K x 8 | - | - | - |
Basis Produktnummer | LPC1857 | LPC18S50 | - | - |
Serie | LPC18xx | LPC18xx | - | - |
Zuel vun I / O | 142 | 118 | - | - |
Datenkonverter | A/D 8x10b; D/A 1x10b | A/D 8x10b; D/A 1x10b | - | - |
Mounting Type | Surface Mount | Surface Mount | - | - |
Speed | 180MHz | 180MHz | - | - |
Peripheralien | Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | - | - |
Core Size | 32-Bit Single-Core | 32-Bit Single-Core | - | - |
Package / Case | 208-LQFP | 180-TFBGA | - | - |
Package protegéieren | Tray | Tray | - | - |
Supplier Device Package | 208-LQFP (28x28) | 180-TFBGA (12x12) | - | - |
RAM Gréisst | 136K x 8 | 200K x 8 | - | - |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | - | - |
Operatioun Temperatur | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | - | - |
Programm Memory Type | FLASH | ROMless | - | - |
Programmspeichergréisst | 1MB (1M x 8) | - | - | - |
Oszilléierertyp | Internal | Internal | - | - |
Core Prozessor | ARM® Cortex®-M3 | ARM® Cortex®-M3 | - | - |
Voltage - Versorgung (Vcc / Vdd) | 2.2V ~ 3.6V | 2.2V ~ 3.6V | - | - |
Eroflueden LPC1857JBD208E PDF DataDhusts an NXP USA Inc. Dokumentatioun fir LPC1857JBD208E - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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