LPC1830FET256 Tech Spezifikatioune
NXP USA Inc. - LPC1830FET256 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - LPC1830FET256
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | NXP Semiconductors | |
| Voltage - Versorgung (Vcc / Vdd) | 2.2V ~ 3.6V | |
| Supplier Device Package | 256-LBGA (17x17) | |
| Speed | 180MHz | |
| Serie | - | |
| RAM Gréisst | 200K x 8 | |
| Programm Memory Type | ROMless | |
| Programmspeichergréisst | - | |
| Peripheralien | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | |
| Package / Case | 256-LBGA | |
| Package protegéieren | Tray |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Oszilléierertyp | Internal | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | |
| Zuel vun I / O | 164 | |
| Mounting Type | Surface Mount | |
| EEPROM Gréisst | - | |
| Datenkonverter | A/D 8x10bSAR; D/A 1x10b | |
| Core Size | 32-Bit | |
| Core Prozessor | ARM® Cortex®-M3 | |
| Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | |
| Basis Produktnummer | LPC1830 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. LPC1830FET256.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | LPC1830FET256 | LPC1833JET100E | LPC1833JET256 | LPC1833FET256 |
| Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP Semiconductors | Freescale / NXP Semiconductors |
| Serie | - | LPC18xx | - | - |
| Oszilléierertyp | Internal | Internal | - | - |
| Basis Produktnummer | LPC1830 | LPC1833 | - | - |
| Zuel vun I / O | 164 | 49 | - | - |
| Mounting Type | Surface Mount | Surface Mount | - | - |
| Programmspeichergréisst | - | 512KB (512K x 8) | - | - |
| Package protegéieren | Tray | Tray | - | - |
| EEPROM Gréisst | - | 16K x 8 | - | - |
| Speed | 180MHz | 180MHz | - | - |
| Programm Memory Type | ROMless | FLASH | - | - |
| Core Prozessor | ARM® Cortex®-M3 | ARM® Cortex®-M3 | - | - |
| Voltage - Versorgung (Vcc / Vdd) | 2.2V ~ 3.6V | 2.2V ~ 3.6V | - | - |
| RAM Gréisst | 200K x 8 | 136K x 8 | - | - |
| Peripheralien | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | Brown-out Detect/Reset, DMA, I²S, POR, WDT | - | - |
| Package / Case | 256-LBGA | 100-TFBGA | - | - |
| Core Size | 32-Bit | 32-Bit Single-Core | - | - |
| Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | - |
| Datenkonverter | A/D 8x10bSAR; D/A 1x10b | A/D 4x10b; D/A 1x10b | - | - |
| Supplier Device Package | 256-LBGA (17x17) | 100-TFBGA (9x9) | - | - |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | - | - |
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|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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