BCM20732S Tech Spezifikatioune
Cypress Semiconductor Corp - BCM20732S technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Cypress Semiconductor Corp - BCM20732S
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Cypress Semiconductor | |
| Voltage - Supply | 1.4V ~ 3.6V | |
| Typ | TxRx + MCU | |
| Supplier Device Package | - | |
| Serie | - | |
| Serial Interfaces | I²C, SPI, UART | |
| Sensibilitéit | - | |
| RF Famill / Standard | Bluetooth | |
| Protokoll | Bluetooth v4.0 | |
| Power - Output | - | |
| Package / Case | 48-SMD Module |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Package protegéieren | Tray | |
| Operatioun Temperatur | -30°C ~ 85°C | |
| Mounting Type | Surface Mount | |
| Modulation | - | |
| Späichergréisst | - | |
| GPIO | 14 | |
| Heefegkeet | 2.4GHz | |
| Data Rate (Max) | - | |
| Aktuell - Iwwerginn | - | |
| Aktuell - kréien | - |
| ATTRESSIOUN | BESCHREIWUNG |
|---|---|
| RoHs Status | |
| Fiichtegkeet Sensibilitéitsniveau (MSL) | 3 (168 Hours) |
| Erreecht Status | REACH Affected |
| ECCN | 5A991C |
| HTSUS | 8542.31.0000 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Cypress Semiconductor Corp BCM20732S.
| Produktiounsattriff |  |
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|
 |
|---|---|---|---|---|
| Part Number | BCM20732S | BCM20733A2KML1G | BCM20730A2KML2G | BCM20730A2KML2G |
| Hiersteller | Cypress Semiconductor Corp | Broadcom Limited | Broadcom Limited | Infineon Technologies |
| Heefegkeet | 2.4GHz | - | - | - |
| Package / Case | 48-SMD Module | - | - | 32-VFQFN Exposed Pad |
| GPIO | 14 | - | - | - |
| Aktuell - kréien | - | - | - | - |
| Package protegéieren | Tray | Tray | Tray | Bulk |
| Späichergréisst | - | - | - | - |
| Serial Interfaces | I²C, SPI, UART | - | - | - |
| RF Famill / Standard | Bluetooth | - | - | - |
| Serie | - | * | * | - |
| Sensibilitéit | - | - | - | - |
| Voltage - Supply | 1.4V ~ 3.6V | - | - | - |
| Aktuell - Iwwerginn | - | - | - | - |
| Data Rate (Max) | - | - | - | - |
| Typ | TxRx + MCU | - | - | - |
| Supplier Device Package | - | - | - | 32-QFN (5x5) |
| Protokoll | Bluetooth v4.0 | - | - | - |
| Modulation | - | - | - | - |
| Mounting Type | Surface Mount | - | - | Surface Mount |
| Operatioun Temperatur | -30°C ~ 85°C | - | - | - |
| Power - Output | - | - | - | - |
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BCM20733A3KML1GInfineon TechnologiesIC BT BLE IEEE 802.15.4BCM20733A3KFB2GAvago Technologies (Broadcom)BCM20733A3KML1GBroadcom LimitedSINGLE-CHIP BLUETOOTHBCM20730A2KFBGAvago Technologies (Broadcom)BCM20734UA1KFFB3GCypress Semiconductor CorpTELECOM CIRCUIT, 1-FUNC, CMOS, P| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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