CYBL10573-56LQXIT Tech Spezifikatioune
Infineon Technologies - CYBL10573-56LQXIT technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Infineon Technologies - CYBL10573-56LQXIT
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Infineon Technologies | |
Voltage - Supply | 1.9V ~ 5.5V | |
Typ | TxRx + MCU | |
Supplier Device Package | 56-QFN (7x7) | |
Serie | PRoC™ BLE | |
Serial Interfaces | - | |
Sensibilitéit | - | |
RF Famill / Standard | Bluetooth | |
Protokoll | Bluetooth v4.2 | |
Power - Output | - | |
Package / Case | 56-UFQFN Exposed Pad |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Package protegéieren | Tape & Reel (TR) | |
Operatioun Temperatur | -40°C ~ 85°C | |
Mounting Type | Surface Mount | |
Modulation | - | |
Späichergréisst | 256kB Flash, 32kB SRAM | |
GPIO | 36 | |
Heefegkeet | 2.4GHz | |
Data Rate (Max) | - | |
Aktuell - Iwwerginn | - | |
Aktuell - kréien | - |
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Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | CYBL10573-56LQXIT | CYBL10573-76FNXIT | CYBL10563-56LQXI | CYBL10573-56LQXI |
Hiersteller | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
Serie | PRoC™ BLE | PRoC® | - | PRoC™ BLE |
Supplier Device Package | 56-QFN (7x7) | 76-WLCSP (4.04×3.87) | 56-QFN (7x7) | 56-QFN (7x7) |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Aktuell - kréien | - | 16.4mA | 16.4mA ~ 21.5mA | - |
GPIO | 36 | - | 36 | 36 |
Heefegkeet | 2.4GHz | 2.4GHz | 2.4GHz | 2.4GHz |
Modulation | - | GFSK | GFSK | - |
RF Famill / Standard | Bluetooth | Bluetooth | Bluetooth | Bluetooth |
Data Rate (Max) | - | 1Mbps | 1Mbps | - |
Voltage - Supply | 1.9V ~ 5.5V | 1.9V ~ 5.5V | 1.8V ~ 5.5V | 1.9V ~ 5.5V |
Serial Interfaces | - | I²C, I²S, SPI, UART | I²C, I²S, SPI, UART | - |
Typ | TxRx + MCU | TxRx + MCU | TxRx + MCU | TxRx + MCU |
Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tray | Tray |
Protokoll | Bluetooth v4.2 | Bluetooth v4.2 | Bluetooth v4.1 | Bluetooth v4.2 |
Operatioun Temperatur | -40°C ~ 85°C | -40°C ~ 105°C | -40°C ~ 105°C | -40°C ~ 85°C |
Package / Case | 56-UFQFN Exposed Pad | 76-UFBGA, WLCSP | 56-UFQFN Exposed Pad | 56-UFQFN Exposed Pad |
Power - Output | - | 3dBm | 3dBm | - |
Sensibilitéit | - | -91dBm | -91dBm | - |
Späichergréisst | 256kB Flash, 32kB SRAM | 256kB Flash, 32kB SRAM | 128kB Flash, 8kB ROM, 16kB SRAM | 256kB Flash, 32kB SRAM |
Aktuell - Iwwerginn | - | 15.6mA | 12.5mA ~ 20mA | - |
Eroflueden CYBL10573-56LQXIT PDF DataDhusts an Infineon Technologies Dokumentatioun fir CYBL10573-56LQXIT - Infineon Technologies.
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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