CY14B108N-ZSP25XI Tech Spezifikatioune
Infineon Technologies - CY14B108N-ZSP25XI technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Infineon Technologies - CY14B108N-ZSP25XI
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Infineon Technologies | |
Schreiwe Cycle Time - Word, Page | 25ns | |
Voltage - Supply | 2.7V ~ 3.6V | |
Technologie | NVSRAM (Non-Volatile SRAM) | |
Supplier Device Package | 54-TSOP II | |
Serie | - | |
Package / Case | 54-TSOP (0.400', 10.16mm Width) | |
Package protegéieren | Tray | |
Operatioun Temperatur | -40°C ~ 85°C (TA) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Mounting Type | Surface Mount | |
Gedächtnis Type | Non-Volatile | |
Späichergréisst | 8Mbit | |
Erënnerungsorganisatioun | 512K x 16 | |
Memory Interface | Parallel | |
Memory Format | NVSRAM | |
Basis Produktnummer | CY14B108 | |
Zougangszäit | 25 ns |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Infineon Technologies CY14B108N-ZSP25XI.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | CY14B108N-ZSP25XI | CY14B116M-ZSP25XI | CY14B108M-ZSP45XI | CY14B108N-BA45XIT |
Hiersteller | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
Technologie | NVSRAM (Non-Volatile SRAM) | NVSRAM (Non-Volatile SRAM) | NVSRAM (Non-Volatile SRAM) | NVSRAM (Non-Volatile SRAM) |
Späichergréisst | 8Mbit | 16Mbit | 8Mbit | 8Mbit |
Gedächtnis Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
Schreiwe Cycle Time - Word, Page | 25ns | 25ns | 45ns | 45ns |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Zougangszäit | 25 ns | 25 ns | 45 ns | 45 ns |
Memory Format | NVSRAM | NVSRAM | NVSRAM | NVSRAM |
Voltage - Supply | 2.7V ~ 3.6V | 2.7V ~ 3.6V | 2.7V ~ 3.6V | 2.7V ~ 3.6V |
Erënnerungsorganisatioun | 512K x 16 | 1M x 16 | 512K x 16 | 512K x 16 |
Serie | - | - | - | - |
Package protegéieren | Tray | Tray | Bulk | Tape & Reel (TR) |
Supplier Device Package | 54-TSOP II | 54-TSOP II | 54-TSOP II | 48-FBGA (6x10) |
Memory Interface | Parallel | Parallel | Parallel | Parallel |
Package / Case | 54-TSOP (0.400', 10.16mm Width) | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP (0.400", 10.16mm Width) | 48-TFBGA |
Basis Produktnummer | CY14B108 | CY14B116 | CY14B108 | CY14B108 |
Eroflueden CY14B108N-ZSP25XI PDF DataDhusts an Infineon Technologies Dokumentatioun fir CY14B108N-ZSP25XI - Infineon Technologies.
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
Wëllt Dir e bessere Präis? A WED AN AMFE NEW, MELLT DIR DIR NËMMEN.