BSM25GB120DN2 Tech Spezifikatioune
Infineon Technologies - BSM25GB120DN2 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Infineon Technologies - BSM25GB120DN2
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Infineon Technologies | |
| Voltage - Collector Emitter Breakdown (Max) | 1200 V | |
| Vce (on) (Max) @ Vge, Ic | 3V @ 15V, 25A | |
| Supplier Device Package | Module | |
| Serie | - | |
| Power - Max | 200 W | |
| Package / Case | Module | |
| Package protegéieren | Bulk | |
| Operatioun Temperatur | 150°C (TJ) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| NTC Thermistor | No | |
| Mounting Type | Chassis Mount | |
| Input Capacitance (Cies) @ Vce | 1.65 nF @ 25 V | |
| Input | Standard | |
| IGBT Type | - | |
| Aktuell - Kollektorat Cutoff (Max) | 800 µA | |
| Aktuell - Sammler (Ic) (Max) | 38 A | |
| Konfiguratioun | Half Bridge |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Infineon Technologies BSM25GB120DN2.
| Produktiounsattriff |  |
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|
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|---|---|---|---|---|
| Part Number | BSM25GB120DN2 | BSM25GD120DLCE3256 | BSM25GD100D | BSM25GD120 |
| Hiersteller | Infineon Technologies | Cypress Semiconductor (Infineon Technologies) | Cypress Semiconductor (Infineon Technologies) | NO |
| Aktuell - Kollektorat Cutoff (Max) | 800 µA | - | - | - |
| Package protegéieren | Bulk | - | - | - |
| NTC Thermistor | No | - | - | - |
| Operatioun Temperatur | 150°C (TJ) | - | - | - |
| Input | Standard | - | - | - |
| Package / Case | Module | - | - | - |
| Mounting Type | Chassis Mount | - | - | - |
| Aktuell - Sammler (Ic) (Max) | 38 A | - | - | - |
| Input Capacitance (Cies) @ Vce | 1.65 nF @ 25 V | - | - | - |
| Serie | - | - | - | - |
| Power - Max | 200 W | - | - | - |
| IGBT Type | - | - | - | - |
| Supplier Device Package | Module | - | - | - |
| Konfiguratioun | Half Bridge | - | - | - |
| Voltage - Collector Emitter Breakdown (Max) | 1200 V | - | - | - |
| Vce (on) (Max) @ Vge, Ic | 3V @ 15V, 25A | - | - | - |
BSM25GD120DLCE3256Cypress Semiconductor (Infineon Technologies)IGBT ModuleBSM25GD100DCypress Semiconductor (Infineon Technologies)IGBT ModuleBSM25GD120NOIGBT ModuleBSM25G120DCypress Semiconductor (Infineon Technologies)IGBT ModuleBSM25GD120DLCE3224Cypress Semiconductor (Infineon Technologies)IGBT Module
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|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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