CDBC560-G Tech Spezifikatioune
Comchip Technology - CDBC560-G technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Comchip Technology - CDBC560-G
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Comchip Technology | |
| Voltage - Viru (Vf) (Max) @ Wann | 750 mV @ 5 A | |
| Voltage - DC Reverse (Vr) (Max) | 60 V | |
| Technologie | Schottky | |
| Supplier Device Package | DO-214AB (SMC) | |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
| Serie | - | |
| Package / Case | DO-214AB, SMC |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Package protegéieren | Tape & Reel (TR) | |
| Operatiounstemperatur - Junction | -40°C ~ 125°C | |
| Mounting Type | Surface Mount | |
| Aktuell - Reverse Leakage @ Vr | 500 µA @ 60 V | |
| Aktuell - duerchschnëttlech rektifizéiert (Io) | 5A | |
| Capacitance @ Vr, F. | - | |
| Basis Produktnummer | CDBC560 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Comchip Technology CDBC560-G.
| Produktiounsattriff |  |
|
 |
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|---|---|---|---|---|
| Part Number | CDBC560-G | CDBC540-G | CDBD660-G | CDBC520-G |
| Hiersteller | Comchip Technology | Comchip Technology | Comchip Technology | Comchip Technology |
| Capacitance @ Vr, F. | - | - | - | - |
| Package / Case | DO-214AB, SMC | DO-214AB, SMC | TO-252-3, DPak (2 Leads + Tab), SC-63 | DO-214AB, SMC |
| Basis Produktnummer | CDBC560 | CDBC540 | - | CDBC520 |
| Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) |
| Voltage - DC Reverse (Vr) (Max) | 60 V | 40 V | 60 V | 20 V |
| Voltage - Viru (Vf) (Max) @ Wann | 750 mV @ 5 A | 550 mV @ 5 A | 750 mV @ 6 A | 550 mV @ 5 A |
| Technologie | Schottky | Schottky | Schottky | Schottky |
| Serie | - | - | - | - |
| Supplier Device Package | DO-214AB (SMC) | DO-214AB (SMC) | DPAK | DO-214AB (SMC) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Aktuell - duerchschnëttlech rektifizéiert (Io) | 5A | 5A | 6A | 5A |
| Aktuell - Reverse Leakage @ Vr | 500 µA @ 60 V | 500 µA @ 40 V | 500 µA @ 60 V | 500 µA @ 20 V |
| Operatiounstemperatur - Junction | -40°C ~ 125°C | -40°C ~ 125°C | -50°C ~ 150°C | -40°C ~ 125°C |
Eroflueden CDBC560-G PDF DataDhusts an Comchip Technology Dokumentatioun fir CDBC560-G - Comchip Technology.
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|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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