DILB40P-223TLF Tech Spezifikatioune
Amphenol ICC (FCI) - DILB40P-223TLF technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Amphenol ICC (FCI) - DILB40P-223TLF
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Amphenol Aorora | |
| Typ | DIP, 0.6' (15.24mm) Row Spacing | |
| Terminatioun Post Length | 0.124' (3.15mm) | |
| Terminatioun | Solder | |
| Serie | - | |
| Pitch - Post | 0.100' (2.54mm) | |
| Pitch - Mating | 0.100' (2.54mm) | |
| Package protegéieren | Tube | |
| Operatioun Temperatur | -55°C ~ 105°C | |
| Unzuel vun Positiounen oder Pins (Grid) | 40 (2 x 20) | |
| Mounting Type | Through Hole | |
| Material Flammbarkeet-Rating | UL94 V-0 |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Logement Material | Polyamide (PA), Nylon | |
| Eegeschaften | Open Frame | |
| Aktuell Bewäertung (Amps) | 1 A | |
| Kontakt Widderstand | 30mOhm | |
| Kontakt Material - Post | Copper Alloy | |
| Kontakt Material - Mataarbechter | Copper Alloy | |
| Kontaktéiert Finish Thickness - Post | 100.0µin (2.54µm) | |
| Kontaktéiert Finish Thickness - Mating | 100.0µin (2.54µm) | |
| Kontakt Kontakt - Post | Tin | |
| Kontakt Schluss - Mataarbechter | Tin | |
| Basis Produktnummer | DILB40P |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Amphenol ICC (FCI) DILB40P-223TLF.
| Produktiounsattriff |  |
 |
 |
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|---|---|---|---|---|
| Part Number | DILB40P-223TLF | 1050281001 | ACA-SPI-006-K01 | DILB40P-223TLF |
| Hiersteller | Amphenol ICC (FCI) | Molex | LOTES | Amphenol ICC (FCI) |
| Kontaktéiert Finish Thickness - Post | 100.0µin (2.54µm) | 50.0µin (1.27µm) | 1.00µin (0.025µm) | 100.0µin (2.54µm) |
| Operatioun Temperatur | -55°C ~ 105°C | - | - | -55°C ~ 105°C |
| Logement Material | Polyamide (PA), Nylon | Thermoplastic | Liquid Crystal Polymer (LCP) | Polyamide (PA), Nylon |
| Typ | DIP, 0.6' (15.24mm) Row Spacing | Camera Socket | SOIC | DIP, 0.6' (15.24mm) Row Spacing |
| Basis Produktnummer | DILB40P | 105028 | - | DILB40P |
| Serie | - | 105028 | - | - |
| Kontakt Material - Post | Copper Alloy | Copper Alloy | Phosphor Bronze | Copper Alloy |
| Kontakt Widderstand | 30mOhm | - | 30mOhm | 30mOhm |
| Eegeschaften | Open Frame | Open Frame | Board Guide, Closed Frame | Open Frame |
| Kontakt Material - Mataarbechter | Copper Alloy | Copper Alloy | Phosphor Bronze | Copper Alloy |
| Package protegéieren | Tube | Tape & Reel (TR) | Tape & Reel (TR) | Tube |
| Mounting Type | Through Hole | Surface Mount | Surface Mount | Through Hole |
| Terminatioun | Solder | Solder | Solder | Solder |
| Pitch - Mating | 0.100' (2.54mm) | 0.035" (0.90mm) | 0.050" (1.27mm) | 0.100' (2.54mm) |
| Terminatioun Post Length | 0.124' (3.15mm) | - | - | 0.124' (3.15mm) |
| Kontakt Kontakt - Post | Tin | Nickel | Gold | Tin |
| Aktuell Bewäertung (Amps) | 1 A | - | - | 1 A |
| Pitch - Post | 0.100' (2.54mm) | 0.035" (0.90mm) | 0.050" (1.27mm) | 0.100' (2.54mm) |
| Unzuel vun Positiounen oder Pins (Grid) | 40 (2 x 20) | 32 (4 x 8) | 16 (2 x 8) | 40 (2 x 20) |
| Kontaktéiert Finish Thickness - Mating | 100.0µin (2.54µm) | 12.0µin (0.30µm) | 1.00µin (0.025µm) | 100.0µin (2.54µm) |
| Kontakt Schluss - Mataarbechter | Tin | Gold | Gold | Tin |
| Material Flammbarkeet-Rating | UL94 V-0 | UL94 V-0 | UL94 V-0 | UL94 V-0 |
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917-83-210-41-005101Preci-DipCONN TRANSIST TO-5 10POS GOLD| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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