FDB8832 Tech Spezifikatioune
onsemi - FDB8832 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu onsemi - FDB8832
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | onsemi | |
Vgs (th) (Max) @ Id | 3V @ 250µA | |
Vgs (Max) | ±20V | |
Technologie | MOSFET (Metal Oxide) | |
Supplier Device Package | D²PAK (TO-263) | |
Serie | PowerTrench® | |
Rds On (Max) @ Id, Vgs | 1.9mOhm @ 80A, 10V | |
Power Dissipation (Max) | 300W (Tc) | |
Package / Case | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | |
Package protegéieren | Tape & Reel (TR) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Operatioun Temperatur | -55°C ~ 175°C (TJ) | |
Mounting Type | Surface Mount | |
Input Capacitance (Ciss) (Max) @ Vds | 11400 pF @ 15 V | |
Gate Charge (Qg) (Max) @ Vgs | 265 nC @ 10 V | |
FET Typ | N-Channel | |
FET Feature | - | |
Fuert Volt (Max Rds On, Min Rds On) | 4.5V, 10V | |
Entworf fir Source Voltage (Vdss) | 30 V | |
Aktuell - Kontinuéierter Drain (Id) @ 25 ° C | 34A (Ta), 80A (Tc) | |
Basis Produktnummer | FDB883 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu onsemi FDB8832.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | FDB8832 | FDB86569-F085 | FDB8860 | FDB8832 |
Hiersteller | onsemi | onsemi | Fairchild Semiconductor | Fairchild Semiconductor |
Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Bulk | Bulk |
Serie | PowerTrench® | Automotive, AEC-Q101, PowerTrench® | PowerTrench® | PowerTrench® |
Supplier Device Package | D²PAK (TO-263) | D²PAK (TO-263) | D²PAK (TO-263) | D2PAK (TO-263) |
Basis Produktnummer | FDB883 | FDB86569 | - | - |
Power Dissipation (Max) | 300W (Tc) | 94W (Tj) | 254W (Tc) | 300W (Tc) |
Gate Charge (Qg) (Max) @ Vgs | 265 nC @ 10 V | 52 nC @ 10 V | 214 nC @ 10 V | 265 nC @ 10 V |
Rds On (Max) @ Id, Vgs | 1.9mOhm @ 80A, 10V | 5.6mOhm @ 80A, 10V | 2.3mOhm @ 80A, 10V | 1.9mOhm @ 80A, 10V |
Fuert Volt (Max Rds On, Min Rds On) | 4.5V, 10V | 10V | 4.5V, 10V | 4.5V, 10V |
Entworf fir Source Voltage (Vdss) | 30 V | 60 V | 30 V | 30 V |
Operatioun Temperatur | -55°C ~ 175°C (TJ) | -55°C ~ 175°C (TJ) | -55°C ~ 175°C (TJ) | -55°C ~ 175°C (TJ) |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Vgs (th) (Max) @ Id | 3V @ 250µA | 4V @ 250µA | 3V @ 250µA | 3V @ 250µA |
Technologie | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) |
Package / Case | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
FET Typ | N-Channel | N-Channel | N-Channel | N-Channel |
FET Feature | - | - | - | - |
Input Capacitance (Ciss) (Max) @ Vds | 11400 pF @ 15 V | 2520 pF @ 30 V | 12585 pF @ 15 V | 11400 pF @ 15 V |
Vgs (Max) | ±20V | ±20V | ±20V | ±20V |
Aktuell - Kontinuéierter Drain (Id) @ 25 ° C | 34A (Ta), 80A (Tc) | 80A (Tc) | 80A (Tc) | 34A (Ta), 80A (Tc) |
Eroflueden FDB8832 PDF DataDhusts an onsemi Dokumentatioun fir FDB8832 - onsemi.
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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