XCZU9CG-2FFVB1156I Tech Spezifikatioune
AMD - XCZU9CG-2FFVB1156I technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu AMD - XCZU9CG-2FFVB1156I
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | AMD Xilinx | |
Supplier Device Package | 1156-FCBGA (35x35) | |
Speed | 533MHz, 1.3GHz | |
Serie | Zynq® UltraScale+™ MPSoC CG | |
RAM Gréisst | 256KB | |
Primäre Attributer | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | |
Peripheralien | DMA, WDT | |
Package / Case | 1156-BBGA, FCBGA |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Package protegéieren | Tray | |
Operatioun Temperatur | -40°C ~ 100°C (TJ) | |
Zuel vun I / O | 328 | |
Flash Size | - | |
Core Prozessor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Basis Produktnummer | XCZU9 | |
Architektur | MCU, FPGA |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu AMD XCZU9CG-2FFVB1156I.
Produktiounsattriff | ||||
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Part Number | XCZU9CG-2FFVB1156I | XCZU7EV-2FFVC1156I | XCZU9CG-1FFVC900I | XCZU7EV-2FFVF1517I |
Hiersteller | AMD | AMD | AMD | AMD |
Architektur | MCU, FPGA | MCU, FPGA | MCU, FPGA | MCU, FPGA |
Supplier Device Package | 1156-FCBGA (35x35) | 1156-FCBGA (35x35) | 900-FCBGA (31x31) | 1517-FCBGA (40x40) |
Basis Produktnummer | XCZU9 | XCZU7 | XCZU9 | XCZU7 |
Core Prozessor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Operatioun Temperatur | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Package / Case | 1156-BBGA, FCBGA | 1156-BBGA, FCBGA | 900-BBGA, FCBGA | 1517-BBGA, FCBGA |
Primäre Attributer | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
Serie | Zynq® UltraScale+™ MPSoC CG | Zynq® UltraScale+™ MPSoC EV | Zynq® UltraScale+™ MPSoC CG | Zynq® UltraScale+™ MPSoC EV |
Zuel vun I / O | 328 | 360 | 204 | 464 |
Speed | 533MHz, 1.3GHz | 533MHz, 600MHz, 1.3GHz | 500MHz, 1.2GHz | 533MHz, 600MHz, 1.3GHz |
Package protegéieren | Tray | Tray | Tray | Tray |
Peripheralien | DMA, WDT | DMA, WDT | DMA, WDT | DMA, WDT |
RAM Gréisst | 256KB | 256KB | 256KB | 256KB |
Flash Size | - | - | - | - |
Eroflueden XCZU9CG-2FFVB1156I PDF DataDhusts an AMD Dokumentatioun fir XCZU9CG-2FFVB1156I - AMD.
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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