XCZU4CG-2SFVC784I Tech Spezifikatioune
AMD - XCZU4CG-2SFVC784I technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu AMD - XCZU4CG-2SFVC784I
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | AMD Xilinx | |
Supplier Device Package | 784-FCBGA (23x23) | |
Speed | 533MHz, 1.3GHz | |
Serie | Zynq® UltraScale+™ MPSoC CG | |
RAM Gréisst | 256KB | |
Primäre Attributer | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | |
Peripheralien | DMA, WDT | |
Package / Case | 784-BFBGA, FCBGA |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Package protegéieren | Tray | |
Operatioun Temperatur | -40°C ~ 100°C (TJ) | |
Zuel vun I / O | 252 | |
Flash Size | - | |
Core Prozessor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Basis Produktnummer | XCZU4 | |
Architektur | MCU, FPGA |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu AMD XCZU4CG-2SFVC784I.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | XCZU4CG-2SFVC784I | XCZU4CG-1SFVC784E | XCZU4CG-1FBVB900I | XCZU4EG-1FBVB900E |
Hiersteller | AMD | AMD | AMD | AMD |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operatioun Temperatur | -40°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
Zuel vun I / O | 252 | 252 | 204 | 204 |
Package / Case | 784-BFBGA, FCBGA | 784-BFBGA, FCBGA | 900-BBGA, FCBGA | 900-BBGA, FCBGA |
Speed | 533MHz, 1.3GHz | 500MHz, 1.2GHz | 500MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz |
Package protegéieren | Tray | Tray | Tray | Tray |
Architektur | MCU, FPGA | MCU, FPGA | MCU, FPGA | MCU, FPGA |
Core Prozessor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Primäre Attributer | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
RAM Gréisst | 256KB | 256KB | 256KB | 256KB |
Flash Size | - | - | - | - |
Peripheralien | DMA, WDT | DMA, WDT | DMA, WDT | DMA, WDT |
Supplier Device Package | 784-FCBGA (23x23) | 784-FCBGA (23x23) | 900-FCBGA (31x31) | 900-FCBGA (31x31) |
Serie | Zynq® UltraScale+™ MPSoC CG | Zynq® UltraScale+™ MPSoC CG | Zynq® UltraScale+™ MPSoC CG | Zynq® UltraScale+™ MPSoC EG |
Basis Produktnummer | XCZU4 | XCZU4 | XCZU4 | XCZU4 |
Eroflueden XCZU4CG-2SFVC784I PDF DataDhusts an AMD Dokumentatioun fir XCZU4CG-2SFVC784I - AMD.
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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