XCZU11EG-1FFVC1760I Tech Spezifikatioune
AMD - XCZU11EG-1FFVC1760I technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu AMD - XCZU11EG-1FFVC1760I
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | AMD Xilinx | |
Supplier Device Package | 1760-FCBGA (42.5x42.5) | |
Speed | 500MHz, 600MHz, 1.2GHz | |
Serie | Zynq® UltraScale+™ MPSoC EG | |
RAM Gréisst | 256KB | |
Primäre Attributer | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | |
Peripheralien | DMA, WDT | |
Package / Case | 1760-BBGA, FCBGA |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Package protegéieren | Tray | |
Operatioun Temperatur | -40°C ~ 100°C (TJ) | |
Zuel vun I / O | 512 | |
Flash Size | - | |
Core Prozessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Basis Produktnummer | XCZU11 | |
Architektur | MCU, FPGA |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu AMD XCZU11EG-1FFVC1760I.
Produktiounsattriff | ||||
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Part Number | XCZU11EG-1FFVC1760I | XCZU11EG-2FFVC1760E | XCZU11EG-2FFVC1760I | XCZU11EG-1FFVC1760E |
Hiersteller | AMD | AMD | AMD | AMD |
Package / Case | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA |
Architektur | MCU, FPGA | MCU, FPGA | MCU, FPGA | MCU, FPGA |
RAM Gréisst | 256KB | 256KB | 256KB | 256KB |
Flash Size | - | - | - | - |
Serie | Zynq® UltraScale+™ MPSoC EG | Zynq® UltraScale+™ MPSoC EG | Zynq® UltraScale+™ MPSoC EG | Zynq® UltraScale+™ MPSoC EG |
Core Prozessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Supplier Device Package | 1760-FCBGA (42.5x42.5) | 1760-FCBGA (42.5x42.5) | 1760-FCBGA (42.5x42.5) | 1760-FCBGA (42.5x42.5) |
Primäre Attributer | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operatioun Temperatur | -40°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
Speed | 500MHz, 600MHz, 1.2GHz | 533MHz, 600MHz, 1.3GHz | 533MHz, 600MHz, 1.3GHz | 500MHz, 600MHz, 1.2GHz |
Peripheralien | DMA, WDT | DMA, WDT | DMA, WDT | DMA, WDT |
Zuel vun I / O | 512 | 512 | 512 | 512 |
Basis Produktnummer | XCZU11 | XCZU11 | XCZU11 | XCZU11 |
Package protegéieren | Tray | Tray | Tray | Tray |
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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