XC7Z045-1FFG676I Tech Spezifikatioune
AMD - XC7Z045-1FFG676I technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu AMD - XC7Z045-1FFG676I
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | AMD Xilinx | |
Supplier Device Package | 676-FCBGA (27x27) | |
Speed | 667MHz | |
Serie | Zynq®-7000 | |
RAM Gréisst | 256KB | |
Primäre Attributer | Kintex™-7 FPGA, 350K Logic Cells | |
Peripheralien | DMA | |
Package / Case | 676-BBGA, FCBGA |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Package protegéieren | Tray | |
Operatioun Temperatur | -40°C ~ 100°C (TJ) | |
Zuel vun I / O | 130 | |
Flash Size | - | |
Core Prozessor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Basis Produktnummer | XC7Z045 | |
Architektur | MCU, FPGA |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu AMD XC7Z045-1FFG676I.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | XC7Z045-1FFG676I | XC7Z045-1FBG676I | XC7Z045-2FBG676E | XC7Z045-2FBG676I |
Hiersteller | AMD | AMD | AMD | AMD |
Zuel vun I / O | 130 | 130 | 130 | 130 |
RAM Gréisst | 256KB | 256KB | 256KB | 256KB |
Speed | 667MHz | 667MHz | 800MHz | 800MHz |
Package protegéieren | Tray | Tray | Tray | Tray |
Basis Produktnummer | XC7Z045 | XC7Z045 | XC7Z045 | XC7Z045 |
Architektur | MCU, FPGA | MCU, FPGA | MCU, FPGA | MCU, FPGA |
Core Prozessor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Supplier Device Package | 676-FCBGA (27x27) | 676-FCBGA (27x27) | 676-FCBGA (27x27) | 676-FCBGA (27x27) |
Package / Case | 676-BBGA, FCBGA | 676-BBGA, FCBGA | 676-BBGA, FCBGA | 676-BBGA, FCBGA |
Peripheralien | DMA | DMA | DMA | DMA |
Serie | Zynq®-7000 | Zynq®-7000 | Zynq®-7000 | Zynq®-7000 |
Flash Size | - | - | - | - |
Operatioun Temperatur | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Primäre Attributer | Kintex™-7 FPGA, 350K Logic Cells | Kintex™-7 FPGA, 350K Logic Cells | Kintex™-7 FPGA, 350K Logic Cells | Kintex™-7 FPGA, 350K Logic Cells |
Eroflueden XC7Z045-1FFG676I PDF DataDhusts an AMD Dokumentatioun fir XC7Z045-1FFG676I - AMD.
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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