XC7Z030-3SBG485E Tech Spezifikatioune
AMD - XC7Z030-3SBG485E technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu AMD - XC7Z030-3SBG485E
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | AMD Xilinx | |
Supplier Device Package | 484-FCBGA (19x19) | |
Speed | 1GHz | |
Serie | Zynq®-7000 | |
RAM Gréisst | 256KB | |
Primäre Attributer | Kintex™-7 FPGA, 125K Logic Cells | |
Peripheralien | DMA | |
Package / Case | 484-FBGA, FCBGA |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Package protegéieren | Tray | |
Operatioun Temperatur | 0°C ~ 100°C (TJ) | |
Zuel vun I / O | 130 | |
Flash Size | - | |
Core Prozessor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Basis Produktnummer | XC7Z030 | |
Architektur | MCU, FPGA |
ATTRESSIOUN | BESCHREIWUNG |
---|---|
RoHs Status | |
Fiichtegkeet Sensibilitéitsniveau (MSL) | 4 (72 Hours) |
Erreecht Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 8542.39.0001 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu AMD XC7Z030-3SBG485E.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | XC7Z030-3SBG485E | XC7Z035-1FBG676C | XC7Z030-L2FFG676I | XC7Z035-1FFG900C |
Hiersteller | AMD | AMD | AMD | AMD |
Serie | Zynq®-7000 | Zynq®-7000 | Zynq®-7000 | Zynq®-7000 |
Zuel vun I / O | 130 | 130 | 130 | 130 |
Speed | 1GHz | 667MHz | 800MHz | 667MHz |
Peripheralien | DMA | DMA | DMA | DMA |
Supplier Device Package | 484-FCBGA (19x19) | 676-FCBGA (27x27) | 676-FCBGA (27x27) | 900-FCBGA (31x31) |
Primäre Attributer | Kintex™-7 FPGA, 125K Logic Cells | Kintex™-7 FPGA, 275K Logic Cells | Kintex™-7 FPGA, 125K Logic Cells | Kintex™-7 FPGA, 275K Logic Cells |
Flash Size | - | - | - | - |
Operatioun Temperatur | 0°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Core Prozessor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architektur | MCU, FPGA | MCU, FPGA | MCU, FPGA | MCU, FPGA |
Package / Case | 484-FBGA, FCBGA | 676-BBGA, FCBGA | 676-BBGA, FCBGA | 900-BBGA, FCBGA |
Package protegéieren | Tray | Tray | Tray | Tray |
Basis Produktnummer | XC7Z030 | XC7Z035 | XC7Z030 | XC7Z035 |
RAM Gréisst | 256KB | 256KB | 256KB | 256KB |
Eroflueden XC7Z030-3SBG485E PDF DataDhusts an AMD Dokumentatioun fir XC7Z030-3SBG485E - AMD.
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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