XC7Z007S-2CLG225E Tech Spezifikatioune
AMD - XC7Z007S-2CLG225E technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu AMD - XC7Z007S-2CLG225E
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | AMD Xilinx | |
| Supplier Device Package | 225-CSPBGA (13x13) | |
| Speed | 766MHz | |
| Serie | Zynq®-7000 | |
| RAM Gréisst | 256KB | |
| Primäre Attributer | Artix™-7 FPGA, 23K Logic Cells | |
| Peripheralien | DMA | |
| Package / Case | 225-LFBGA, CSPBGA |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Package protegéieren | Tray | |
| Operatioun Temperatur | 0°C ~ 100°C (TJ) | |
| Zuel vun I / O | 54 | |
| Flash Size | - | |
| Core Prozessor | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Basis Produktnummer | XC7Z007 | |
| Architektur | MCU, FPGA |
| ATTRESSIOUN | BESCHREIWUNG |
|---|---|
| RoHs Status | |
| Fiichtegkeet Sensibilitéitsniveau (MSL) | 3 (168 Hours) |
| Erreecht Status | REACH Unaffected |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu AMD XC7Z007S-2CLG225E.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | XC7Z007S-2CLG225E | XC7Z007S-1CLG225C | XC7Z007S-1CLG400I | XC7Z007S-2CLG400E |
| Hiersteller | AMD | AMD | AMD | AMD |
| Peripheralien | DMA | DMA | DMA | DMA |
| Zuel vun I / O | 54 | 54 | 100 | 100 |
| Speed | 766MHz | 667MHz | 667MHz | 766MHz |
| Basis Produktnummer | XC7Z007 | XC7Z007 | XC7Z007 | XC7Z007 |
| Primäre Attributer | Artix™-7 FPGA, 23K Logic Cells | Artix™-7 FPGA, 23K Logic Cells | Artix™-7 FPGA, 23K Logic Cells | Artix™-7 FPGA, 23K Logic Cells |
| Package protegéieren | Tray | Tray | Tray | Tray |
| Core Prozessor | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAM Gréisst | 256KB | 256KB | 256KB | 256KB |
| Operatioun Temperatur | 0°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
| Architektur | MCU, FPGA | MCU, FPGA | MCU, FPGA | MCU, FPGA |
| Konnektivitéit | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Serie | Zynq®-7000 | Zynq®-7000 | Zynq®-7000 | Zynq®-7000 |
| Package / Case | 225-LFBGA, CSPBGA | 225-LFBGA, CSPBGA | 400-LFBGA, CSPBGA | 400-LFBGA, CSPBGA |
| Supplier Device Package | 225-CSPBGA (13x13) | 225-CSPBGA (13x13) | 400-CSPBGA (17x17) | 400-CSPBGA (17x17) |
| Flash Size | - | - | - | - |
Eroflueden XC7Z007S-2CLG225E PDF DataDhusts an AMD Dokumentatioun fir XC7Z007S-2CLG225E - AMD.
XC7VX980T-2FFG1930CAMDIC FPGA 900 I/O 1930FCBGA
XC7Z010-1CLG400XILINXXC7VX980T-2FFG1930IAMD XilinxXC7VX980T-L2FFG1926EAMDIC FPGA 720 I/O 1926FCBGAXC7Z007S-1CLG225CAMDIC SOC CORTEX-A9 667MHZ 225BGAXC7Z007S-1CLG400IAMDIC SOC CORTEX-A9 667MHZ 400BGAXC7Z007S-2CLG400EAMDIC SOC CORTEX-A9 766MHZ 400BGAXC7Z007S-1CLG225IAMDIC SOC CORTEX-A9 667MHZ 225BGAXC7Z007S-3CLG400EAMD XilinxXC7Z010-1CLG400IAMDIC SOC CORTEX-A9 667MHZ 400BGAXC7VX980T-L2FFG1930EAMDIC FPGA 900 I/O 1930FCBGAXC7Z010-1CLG225IAMDIC SOC CORTEX-A9 667MHZ 225BGAXC7Z007S-2CLG225IAMDIC SOC CORTEX-A9 766MHZ 225BGAXC7Z010-1CLG400CAMDIC SOC CORTEX-A9 667MHZ 400BGAXC7Z007S-2CLG400IAMDIC SOC CORTEX-A9 766MHZ 400BGAXC7Z007S-1CLG400CAMDIC SOC CORTEX-A9 667MHZ 400BGAXC7VX980T-2FFG1928IAMD XilinxXC7Z010-1CLG225CAMDIC SOC CORTEX-A9 667MHZ 225BGA| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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