W987D6HBGX6I Tech Spezifikatioune
Winbond Electronics - W987D6HBGX6I technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Winbond Electronics - W987D6HBGX6I
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Winbond Electronics Corporation | |
| Schreiwe Cycle Time - Word, Page | 15ns | |
| Voltage - Supply | 1.7V ~ 1.95V | |
| Technologie | SDRAM - Mobile LPSDR | |
| Supplier Device Package | 54-VFBGA (8x9) | |
| Serie | - | |
| Package / Case | 54-TFBGA | |
| Package protegéieren | Tray | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Mounting Type | Surface Mount | |
| Gedächtnis Type | Volatile | |
| Späichergréisst | 128Mbit | |
| Erënnerungsorganisatioun | 8M x 16 | |
| Memory Interface | Parallel | |
| Memory Format | DRAM | |
| Clock Frequency | 166 MHz | |
| Basis Produktnummer | W987D6 | |
| Zougangszäit | 5.4 ns |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Winbond Electronics W987D6HBGX6I.
| Produktiounsattriff |  |
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 |
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|---|---|---|---|---|
| Part Number | W987D6HBGX6I | W9864G6KH-5 | W988D6FBGX7I | W988D6FBGX7E |
| Hiersteller | Winbond Electronics | Winbond Electronics | Winbond Electronics | Winbond Electronics |
| Memory Format | DRAM | DRAM | DRAM | DRAM |
| Package protegéieren | Tray | Tray | Tray | Tray |
| Zougangszäit | 5.4 ns | 5 ns | 5.4 ns | 5.4 ns |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TC) | -25°C ~ 85°C (TC) |
| Supplier Device Package | 54-VFBGA (8x9) | 54-TSOP II | 54-VFBGA (8x9) | 54-VFBGA (8x9) |
| Voltage - Supply | 1.7V ~ 1.95V | 3V ~ 3.6V | 1.7V ~ 1.95V | 1.7V ~ 1.95V |
| Package / Case | 54-TFBGA | 54-TSOP (0.400", 10.16mm Width) | 54-TFBGA | 54-TFBGA |
| Späichergréisst | 128Mbit | 64Mbit | 256Mbit | 256Mbit |
| Clock Frequency | 166 MHz | 200 MHz | 133 MHz | 133 MHz |
| Memory Interface | Parallel | Parallel | LVCMOS | Parallel |
| Gedächtnis Type | Volatile | Volatile | Volatile | Volatile |
| Erënnerungsorganisatioun | 8M x 16 | 4M x 16 | 16M x 16 | 16M x 16 |
| Serie | - | - | - | - |
| Technologie | SDRAM - Mobile LPSDR | SDRAM | SDRAM - Mobile LPSDR | SDRAM - Mobile LPSDR |
| Basis Produktnummer | W987D6 | W9864G6 | W988D6 | W988D6 |
| Schreiwe Cycle Time - Word, Page | 15ns | - | 15ns | 15ns |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Eroflueden W987D6HBGX6I PDF DataDhusts an Winbond Electronics Dokumentatioun fir W987D6HBGX6I - Winbond Electronics.
W9864G6KH-5Winbond ElectronicsIC DRAM 64MBIT PAR 54TSOP IIW988D6FBGX7Winbond Electronics CorporationW988D6FBGX7IWinbond ElectronicsIC DRAM 256MBIT LVCMOS 54VFBGAW988D6FBGX7EWinbond ElectronicsIC DRAM 256MBIT PAR 54VFBGAW9864GZIH-6Winbond Electronics CorporationW9864G6KH-6 DDRWinbond Electronics CorporationW987D6HBGX7EWinbond ElectronicsIC DRAM 128MBIT PAR 54VFBGAW9864L6JB-7Winbond Electronics Corporation
W988D2FBJX6IWinbond ElectronicsIC DRAM 256MBIT PAR 90VFBGA
W9864Y6KH-6I16W989D6DBGX6IWinbond ElectronicsIC DRAM 512MBIT PAR 54VFBGAW9864G6KH-6Winbond ElectronicsIC DRAM 64MBIT PAR 54TSOP IIW989D6KBGX6IWINBONDW989D6CBGX6EWinbond Electronics CorporationW988D6FBGX6EWinbond ElectronicsIC DRAM 256MBIT PAR 54VFBGAW9864G6KH-6IWinbond ElectronicsIC DRAM 64MBIT PAR 54TSOP IIW987D6HBGX6EWinbond ElectronicsIC DRAM 128MBIT PAR 54VFBGAW9864G6XH-6WINBONB| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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