FST30100 Tech Spezifikatioune
Microsemi Corporation - FST30100 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microsemi Corporation - FST30100
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Microsemi | |
| Voltage - Viru (Vf) (Max) @ Wann | 850 mV @ 15 A | |
| Voltage - DC Reverse (Vr) (Max) | 100 V | |
| Technologie | Schottky | |
| Supplier Device Package | TO-247AD | |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
| Serie | - |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Package / Case | TO-3P-3 Full Pack | |
| Package protegéieren | Bulk | |
| Operatiounstemperatur - Junction | -55°C ~ 175°C | |
| Mounting Type | Through Hole | |
| Diode Configuration | 1 Pair Common Cathode | |
| Aktuell - Reverse Leakage @ Vr | 500 µA @ 100 V | |
| Aktuell - duerchschnëttlech rektifizéiert (Io) (pro Diode) | 15A |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Microsemi Corporation FST30100.
| Produktiounsattriff |  |
 |
 |
 |
|---|---|---|---|---|
| Part Number | FST30100 | FST30050 | FST3125MTCX | FST3125DR2G |
| Hiersteller | Microsemi Corporation | Microsemi Corporation | onsemi | onsemi |
| Mounting Type | Through Hole | Screw Mount | Surface Mount | Surface Mount |
| Diode Configuration | 1 Pair Common Cathode | 1 Pair Common Cathode | - | - |
| Technologie | Schottky | Schottky | - | - |
| Aktuell - Reverse Leakage @ Vr | 500 µA @ 100 V | 4 mA @ 50 V | - | - |
| Package / Case | TO-3P-3 Full Pack | TO-244AB | 14-TSSOP (0.173', 4.40mm Width) | 14-SOIC (0.154', 3.90mm Width) |
| Supplier Device Package | TO-247AD | TO-244 | 14-TSSOP | 14-SOIC |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) | - | - |
| Voltage - Viru (Vf) (Max) @ Wann | 850 mV @ 15 A | 760 mV @ 200 A | - | - |
| Aktuell - duerchschnëttlech rektifizéiert (Io) (pro Diode) | 15A | 150A | - | - |
| Serie | - | - | - | - |
| Voltage - DC Reverse (Vr) (Max) | 100 V | 50 V | - | - |
| Operatiounstemperatur - Junction | -55°C ~ 175°C | - | - | - |
| Package protegéieren | Bulk | Bulk | Tape & Reel (TR) | Tape & Reel (TR) |
Eroflueden FST30100 PDF DataDhusts an Microsemi Corporation Dokumentatioun fir FST30100 - Microsemi Corporation.
FST3125MTCXonsemiIC BUS SWITCH 1 X 1:1 14TSSOPFST3125DR2GonsemiIC BUS SWITCH 1 X 1:1 14SOIC
FST30Z6Sanken Electric Co., Ltd.IGBT ModuleFST22245DMSCIGBT ModuleFST30050Microsemi CorporationDIODE MODULE 50V 150A TO244FST3125MFairchild SemiconductorIC BUS SWITCH 1 X 1:1 14SOICFST3125MonsemiIC BUS SWITCH 1 X 1:1 14SOICFST30035MicrosemiIGBT ModuleFST20045 FST30045SiemensIGBT Module
FST3125Fairchild (onsemi)FST30Z2Sanken Electric Co., Ltd.IGBT ModuleFST201MITSUBISHIIGBT ModuleFST30045SiemensIGBT ModuleFST20050MicrosemiIGBT ModuleFST3125MTConsemiIC BUS SWITCH 1 X 1:1 14TSSOP
FST3125MTCFairchild SemiconductorIC BUS SWITCH 1 X 1:1 14TSSOPFST20045SEMIKRONIGBT ModuleFST30040SiemensIGBT Module| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
Wëllt Dir e bessere Präis? A WED AN AMFE NEW, MELLT DIR DIR NËMMEN.