MCP23S17-E/SP Tech Spezifikatioune
Microchip Technology - MCP23S17-E/SP technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microchip Technology - MCP23S17-E/SP
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Microchip Technology | |
| Voltage - Supply | 1.8V ~ 5.5V | |
| Supplier Device Package | 28-SPDIP | |
| Serie | - | |
| Package / Case | 28-DIP (0.300', 7.62mm) | |
| Package protegéieren | Tube | |
| Ausgängegkeet | Push-Pull | |
| Operatioun Temperatur | -40°C ~ 125°C |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Zuel vun I / O | 16 | |
| Mounting Type | Through Hole | |
| Interrupt Output | Yes | |
| Interface | SPI | |
| Eegeschaften | POR | |
| Aktuell - Ausgangsquell / Spull | 25mA | |
| Clock Frequency | 10 MHz | |
| Basis Produktnummer | MCP23S17 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Microchip Technology MCP23S17-E/SP.
| Produktiounsattriff |  |
 |
 |
 |
|---|---|---|---|---|
| Part Number | MCP23S17-E/SP | MCP23S08T-E/ML | MCP23S09-E/MG | MCP23S17-E/SS |
| Hiersteller | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Voltage - Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 5.5V |
| Aktuell - Ausgangsquell / Spull | 25mA | 25mA | 25mA | 25mA |
| Supplier Device Package | 28-SPDIP | 20-QFN (4x4) | 16-QFN (3x3) | 28-SSOP |
| Clock Frequency | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| Ausgängegkeet | Push-Pull | Push-Pull | Open Drain | Push-Pull |
| Eegeschaften | POR | POR | - | POR |
| Zuel vun I / O | 16 | 8 | 8 | 16 |
| Interface | SPI | SPI | SPI | SPI |
| Interrupt Output | Yes | Yes | Yes | Yes |
| Package protegéieren | Tube | Tape & Reel (TR) | Tube | Tube |
| Basis Produktnummer | MCP23S17 | MCP23S08 | MCP23S09 | MCP23S17 |
| Mounting Type | Through Hole | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | 28-DIP (0.300', 7.62mm) | 20-VFQFN Exposed Pad | 16-VFQFN Exposed Pad | 28-SSOP (0.209", 5.30mm Width) |
| Operatioun Temperatur | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C | -40°C ~ 125°C |
| Serie | - | - | - | - |
Eroflueden MCP23S17-E/SP PDF DataDhusts an Microchip Technology Dokumentatioun fir MCP23S17-E/SP - Microchip Technology.
MCP23S08T-E/MLMicrochip TechnologyIC XPNDR 10MHZ SPI 20QFNMCP23S09-E/MGMicrochip TechnologyIC XPNDR 10MHZ SPI 16QFNMCP23S17-E/SSMicrochip TechnologyIC XPNDR 10MHZ SPI 28SSOP
MCP23S08T-E/SOMicrochip TechnologyIC XPNDR 10MHZ SPI 18SOIC
MCP23S18-E/SOMicrochip TechnologyIC XPNDR 10MHZ SPI 28SOICMCP23S17T-E/SSMicrochip TechnologyIC XPNDR 10MHZ SPI 28SSOPMCP23S09T-E/SOMicrochipMCP23S09T-E/MGMicrochip
MCP23S18T-E/MJMicrochip TechnologyIC XPNDR 10MHZ SPI 24QFNMCP23S18-E/SPMicrochip TechnologyIC XPNDR 10MHZ SPI 28SDIPMCP23S09-E/SOMicrochipMCP23S17T-E/SOMicrochip TechnologyIC XPNDR 10MHZ SPI 28SOIC
MCP23S17T-E/MLMicrochip TechnologyIC XPNDR 10MHZ SPI 28QFN
MCP23S08T-E/SSMicrochip TechnologyIC XPNDR 10MHZ SPI 20SSOPMCP23S18-E/MJMicrochipMCP23S17-E/SOMicrochip TechnologyIC XPNDR 10MHZ SPI 28SOICMCP23S17-I/SSMicrel / Microchip TechnologyMCP23S17-E/MLMicrochip TechnologyIC XPNDR 10MHZ SPI 28QFN| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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