CDLL5819 Tech Spezifikatioune
Microchip Technology - CDLL5819 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microchip Technology - CDLL5819
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Microchip Technology | |
Voltage - Viru (Vf) (Max) @ Wann | 490 mV @ 1 A | |
Voltage - DC Reverse (Vr) (Max) | 45 V | |
Technologie | Schottky | |
Supplier Device Package | DO-213AB | |
Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
Serie | - | |
Package / Case | DO-213AB, MELF |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Package protegéieren | Bulk | |
Operatiounstemperatur - Junction | -65°C ~ 125°C | |
Mounting Type | Surface Mount | |
Aktuell - Reverse Leakage @ Vr | 50 µA @ 45 V | |
Aktuell - duerchschnëttlech rektifizéiert (Io) | 1A | |
Capacitance @ Vr, F. | 70pF @ 5V, 1MHz | |
Basis Produktnummer | CDLL5819 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Microchip Technology CDLL5819.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | CDLL5819 | 1N3164 | DSEP30-06CR | STPS30SM120ST |
Hiersteller | Microchip Technology | Solid State Inc. | IXYS | STMicroelectronics |
Voltage - Viru (Vf) (Max) @ Wann | 490 mV @ 1 A | 1.25 V @ 240 A | 3.07 V @ 30 A | 950 mV @ 30 A |
Package / Case | DO-213AB, MELF | DO-205AB, DO-9, Stud | TO-247-3 | TO-220-3 |
Aktuell - Reverse Leakage @ Vr | 50 µA @ 45 V | 75 µA @ 200 V | 250 µA @ 600 V | 275 µA @ 120 V |
Aktuell - duerchschnëttlech rektifizéiert (Io) | 1A | 240A | 30A | 30A |
Voltage - DC Reverse (Vr) (Max) | 45 V | 200 V | 600 V | 120 V |
Operatiounstemperatur - Junction | -65°C ~ 125°C | -65°C ~ 200°C | -55°C ~ 175°C | 150°C (Max) |
Technologie | Schottky | Standard | Standard | Schottky |
Supplier Device Package | DO-213AB | DO-9 | ISOPLUS247™ | TO-220 |
Capacitance @ Vr, F. | 70pF @ 5V, 1MHz | - | - | - |
Speed | Fast Recovery =< 500ns, > 200mA (Io) | Standard Recovery >500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) |
Serie | - | - | HiPerDynFRED™ | ECOPACK®2 |
Mounting Type | Surface Mount | Stud Mount | Through Hole | Through Hole |
Package protegéieren | Bulk | Box | Tube | Tube |
Basis Produktnummer | CDLL5819 | - | DSEP30 | STPS30 |
Eroflueden CDLL5819 PDF DataDhusts an Microchip Technology Dokumentatioun fir CDLL5819 - Microchip Technology.
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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