APT2X61D60J Tech Spezifikatioune
Microchip Technology - APT2X61D60J technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microchip Technology - APT2X61D60J
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Microchip Technology | |
| Voltage - Viru (Vf) (Max) @ Wann | 1.8 V @ 60 A | |
| Voltage - DC Reverse (Vr) (Max) | 600 V | |
| Technologie | Standard | |
| Supplier Device Package | ISOTOP® | |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
| Serie | - | |
| Reverse Recovery Time (trr) | 130 ns |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Package / Case | SOT-227-4, miniBLOC | |
| Package protegéieren | Tube | |
| Mounting Type | Chassis Mount | |
| Diode Configuration | 2 Independent | |
| Aktuell - Reverse Leakage @ Vr | 250 µA @ 600 V | |
| Aktuell - duerchschnëttlech rektifizéiert (Io) (pro Diode) | 60A | |
| Basis Produktnummer | APT2X61 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Microchip Technology APT2X61D60J.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | APT2X61D60J | APT2X61DC120J | APT2X61DC60J | APT2X61D40J |
| Hiersteller | Microchip Technology | Microchip Technology | Microsemi Corporation | Microchip Technology |
| Reverse Recovery Time (trr) | 130 ns | 0 ns | 0 ns | 37 ns |
| Aktuell - duerchschnëttlech rektifizéiert (Io) (pro Diode) | 60A | 60A | 60A | 60A |
| Basis Produktnummer | APT2X61 | APT2X61 | APT2X61 | APT2X61 |
| Serie | - | - | - | - |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | No Recovery Time > 500mA (Io) | No Recovery Time > 500mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) |
| Supplier Device Package | ISOTOP® | SOT-227 | ISOTOP® | ISOTOP® |
| Package protegéieren | Tube | Bulk | Bulk | Tube |
| Aktuell - Reverse Leakage @ Vr | 250 µA @ 600 V | 1.2 mA @ 1200 V | 1.2 mA @ 600 V | 250 µA @ 400 V |
| Voltage - Viru (Vf) (Max) @ Wann | 1.8 V @ 60 A | 1.8 V @ 60 A | 1.8 V @ 60 A | 1.5 V @ 60 A |
| Technologie | Standard | SiC (Silicon Carbide) Schottky | SiC (Silicon Carbide) Schottky | Standard |
| Package / Case | SOT-227-4, miniBLOC | SOT-227-4, miniBLOC | SOT-227-4, miniBLOC | SOT-227-4, miniBLOC |
| Mounting Type | Chassis Mount | Chassis Mount | Chassis Mount | Chassis Mount |
| Diode Configuration | 2 Independent | 2 Independent | 2 Independent | 2 Independent |
| Voltage - DC Reverse (Vr) (Max) | 600 V | 1200 V | 600 V | 400 V |
Eroflueden APT2X61D60J PDF DataDhusts an Microchip Technology Dokumentatioun fir APT2X61D60J - Microchip Technology.
APT2X61DC120JMicrochip TechnologyDIODE MODULE 1.2KV 60A SOT227
APT2X61D80JMicrosemiIGBT ModuleAPT2X61DC60JMicrosemi CorporationDIODE MODULE 600V 60A ISOTOP
APT2X61D50JAPTIGBT ModuleAPT2X61D40JMicrochip TechnologyDIODE MODULE 400V 60A ISOTOPAPT2X61D90JMicrosemiIGBT ModuleAPT2X61DQ60JMicrochip TechnologyDIODE MODULE 600V 60A ISOTOPAPT2X61DQ120JMicrochip TechnologyDIODE MODULE 1.2KV 60A ISOTOPAPT2X61D20JMicrochip TechnologyDIODE MODULE 200V 60A ISOTOPAPT2X61DQ100JMicrochip TechnologyDIODE MODULE 1KV 60A ISOTOPAPT2X61-06CAPTIGBT ModuleAPT2X61D100JMicrochip TechnologyDIODE MODULE 1KV 55A ISOTOPAPT2X61D120JMicrochip TechnologyDIODE MODULE 1.2KV 53A ISOTOPAPT2X61D30JMicrochip TechnologyDIODE MODULE 300V 60A ISOTOPAPT2X61S100JMicrosemiIGBT ModuleAPT2X61DC100JMicrosemiIGBT ModuleAPT2X61D06JAPTIGBT ModuleAPT2X61D10CJAPTIGBT Module| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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