TLV9152IDDFR Tech Spezifikatioune
Texas Instruments - TLV9152IDDFR technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Texas Instruments - TLV9152IDDFR
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Texas Instruments | |
Spannung - Versuergungspann (min) | 2.7 V | |
Spannung - Versuergungspann (Max) | 16 V | |
Voltage - Input Offset | 125 µV | |
Supplier Device Package | TSOT-23-8 | |
Slew Rate | 20V/µs | |
Serie | - | |
Package / Case | SOT-23-8 | |
Package protegéieren | Tape & Reel (TR) | |
Ausgängegkeet | Rail-to-Rail |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Operatioun Temperatur | -40°C ~ 125°C (TA) | |
Zuel vu Circuits | 2 | |
Mounting Type | Surface Mount | |
Band Bandbreed Produkt | 4.5 MHz | |
Aktuell - Versioun | 560µA (x2 Channels) | |
Aktuell - Ausgab / Kanal | 75 mA | |
Aktuell - Input Bias | 10 pA | |
Basis Produktnummer | TLV9152 | |
Verstäerkungstyp | General Purpose |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Texas Instruments TLV9152IDDFR.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | TLV9152IDDFR | TLV9104SIRTER | TLV9151IDCKR | TLV9154IDR |
Hiersteller | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
Voltage - Input Offset | 125 µV | 300 µV | 125 µV | 125 µV |
Zuel vu Circuits | 2 | 4 | 1 | 4 |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Operatioun Temperatur | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
Band Bandbreed Produkt | 4.5 MHz | 1.1 MHz | 4.5 MHz | 4.5 MHz |
Aktuell - Input Bias | 10 pA | 10 pA | 10 pA | 10 pA |
Spannung - Versuergungspann (min) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Supplier Device Package | TSOT-23-8 | 16-WQFN (3x3) | SC-70-5 | 14-SOIC |
Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) |
Aktuell - Ausgab / Kanal | 75 mA | 80 mA | 75 mA | 75 mA |
Serie | - | - | - | - |
Basis Produktnummer | TLV9152 | - | - | TLV9154 |
Ausgängegkeet | Rail-to-Rail | Rail-to-Rail | Rail-to-Rail | Rail-to-Rail |
Spannung - Versuergungspann (Max) | 16 V | 16 V | 16 V | 16 V |
Aktuell - Versioun | 560µA (x2 Channels) | 115µA (x4 Channels) | 560µA | 560µA (x4 Channels) |
Package / Case | SOT-23-8 | 16-WFQFN Exposed Pad | 5-TSSOP, SC-70-5, SOT-353 | 14-SOIC (0.154", 3.90mm Width) |
Slew Rate | 20V/µs | 4.5V/µs | 21V/µs | 20V/µs |
Verstäerkungstyp | General Purpose | General Purpose | General Purpose | General Purpose |
Eroflueden TLV9152IDDFR PDF DataDhusts an Texas Instruments Dokumentatioun fir TLV9152IDDFR - Texas Instruments.
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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