INMP621ACEZ-R0 Tech Spezifikatioune
TDK InvenSense - INMP621ACEZ-R0 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu TDK InvenSense - INMP621ACEZ-R0
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | InvenSense/TDK | |
Voltage Range | 1.62 V ~ 3.63 V | |
Typ | MEMS (Silicon) | |
Terminatioun | Solder Pads | |
Gréisst / Dimensioun | 0.157' L x 0.118' W (4.00mm x 3.00mm) | |
Form | Rectangular | |
Serie | INMP621 | |
Sensibilitéit | -46dB ±2dB @ 94dB SPL | |
S / N Ratio | 65dB |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Port Location | Bottom | |
Package protegéieren | Tape & Reel (TR) | |
Ausgängegkeet | Digital, PDM | |
Héicht (Max) | 0.043' (1.10mm) | |
Frequenzbereedung | 45 Hz ~ 20 kHz | |
Direktioun | Omnidirectional | |
Aktuell - Versioun | 1.6 mA | |
Basis Produktnummer | INMP621 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu TDK InvenSense INMP621ACEZ-R0.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | INMP621ACEZ-R0 | MP34DT05TR-A | SPUL409HE5H-PB | INMP441ACEZ-R7 |
Hiersteller | TDK InvenSense | STMicroelectronics | Knowles | TDK InvenSense |
Port Location | Bottom | Top | Top | Bottom |
Aktuell - Versioun | 1.6 mA | 650 µA | 190 µA | 1.6 mA |
Ausgängegkeet | Digital, PDM | Digital, PDM | Analog | Digital, I²S |
Form | Rectangular | Rectangular | Rectangular | Rectangular |
Sensibilitéit | -46dB ±2dB @ 94dB SPL | -26dB ±3dB @ 94dB SPL | -42dB ±3dB @ 94dB SPL | -26dB ±3dB @ 94dB SPL |
Voltage Range | 1.62 V ~ 3.63 V | - | 1.5 V ~ 3.6 V | 1.62 V ~ 3.63 V |
Serie | INMP621 | - | SiSonic™ | INMP441 |
Frequenzbereedung | 45 Hz ~ 20 kHz | 100 Hz ~ 10 kHz | 100 Hz ~ 10 kHz | 60 Hz ~ 15 kHz |
S / N Ratio | 65dB | 64dB | 59dB | 61dB |
Gréisst / Dimensioun | 0.157' L x 0.118' W (4.00mm x 3.00mm) | 0.118" L x 0.157" W (3.00mm x 4.00mm) | 0.148' L x 0.116' W (3.76mm x 2.95mm) | 0.186" L x 0.148" W (4.72mm x 3.76mm) |
Direktioun | Omnidirectional | Omnidirectional | Omnidirectional | Omnidirectional |
Terminatioun | Solder Pads | Solder Pads | Solder Pads | Solder Pads |
Basis Produktnummer | INMP621 | MP34DT05 | - | - |
Héicht (Max) | 0.043' (1.10mm) | 0.043" (1.10mm) | 0.047' (1.20mm) | 0.041" (1.05mm) |
Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) |
Typ | MEMS (Silicon) | MEMS (Silicon) | MEMS (Silicon) | MEMS (Silicon) |
Eroflueden INMP621ACEZ-R0 PDF DataDhusts an TDK InvenSense Dokumentatioun fir INMP621ACEZ-R0 - TDK InvenSense.
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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