MKE02Z32VLD4R Tech Spezifikatioune
NXP USA Inc. - MKE02Z32VLD4R technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - MKE02Z32VLD4R
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 2.7V ~ 5.5V | |
Supplier Device Package | 44-LQFP (10x10) | |
Speed | 40MHz | |
Serie | Kinetis KE02 | |
RAM Gréisst | 4K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 32KB (32K x 8) | |
Peripheralien | LVD, PWM, WDT | |
Package / Case | 44-LQFP | |
Package protegéieren | Tape & Reel (TR) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 105°C (TA) | |
Zuel vun I / O | 37 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | 256 x 8 | |
Datenkonverter | A/D 16x12b; D/A 2x6b | |
Core Size | 32-Bit Single-Core | |
Core Prozessor | ARM® Cortex®-M0+ | |
Konnektivitéit | I²C, SPI, UART/USART | |
Basis Produktnummer | MKE02Z32 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. MKE02Z32VLD4R.
Produktiounsattriff | ||||
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Part Number | MKE02Z32VLD4R | MKE02Z32VLC4 | MKE02Z64VLC4 | MKE02Z32VLH2 |
Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. |
Supplier Device Package | 44-LQFP (10x10) | 32-LQFP (7x7) | 32-LQFP (7x7) | 64-LQFP (10x10) |
Programmspeichergréisst | 32KB (32K x 8) | 32KB (32K x 8) | 64KB (64K x 8) | 32KB (32K x 8) |
Package protegéieren | Tape & Reel (TR) | Tray | Tray | Tray |
RAM Gréisst | 4K x 8 | 4K x 8 | 4K x 8 | 4K x 8 |
Basis Produktnummer | MKE02Z32 | MKE02Z32 | MKE02Z64 | MKE02Z32 |
Operatioun Temperatur | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
Core Size | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core |
Serie | Kinetis KE02 | Kinetis KE02 | Kinetis KE02 | Kinetis KE02 |
Speed | 40MHz | 40MHz | 40MHz | 20MHz |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
EEPROM Gréisst | 256 x 8 | 256 x 8 | 256 x 8 | 256 x 8 |
Package / Case | 44-LQFP | 32-LQFP | 32-LQFP | 64-LQFP |
Zuel vun I / O | 37 | 28 | 28 | 57 |
Voltage - Versorgung (Vcc / Vdd) | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
Core Prozessor | ARM® Cortex®-M0+ | ARM® Cortex®-M0+ | ARM® Cortex®-M0+ | ARM® Cortex®-M0+ |
Konnektivitéit | I²C, SPI, UART/USART | I²C, SPI, UART/USART | I²C, SPI, UART/USART | I²C, SPI, UART/USART |
Datenkonverter | A/D 16x12b; D/A 2x6b | A/D 16x12b; D/A 2x6b | A/D 16x12b; D/A 2x6b | A/D 16x12b; D/A 2x6b |
Peripheralien | LVD, PWM, WDT | LVD, PWM, WDT | LVD, PWM, WDT | LVD, PWM, WDT |
Oszilléierertyp | Internal | Internal | Internal | Internal |
Eroflueden MKE02Z32VLD4R PDF DataDhusts an NXP USA Inc. Dokumentatioun fir MKE02Z32VLD4R - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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