MC9S08DZ60ACLH Tech Spezifikatioune
NXP USA Inc. - MC9S08DZ60ACLH technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - MC9S08DZ60ACLH
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 2.7V ~ 5.5V | |
Supplier Device Package | 64-LQFP (10x10) | |
Speed | 40MHz | |
Serie | S08 | |
RAM Gréisst | 4K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 60KB (60K x 8) | |
Peripheralien | LVD, POR, PWM, WDT | |
Package / Case | 64-LQFP | |
Package protegéieren | Tray |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | External | |
Operatioun Temperatur | -40°C ~ 85°C (TA) | |
Zuel vun I / O | 53 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | 2K x 8 | |
Datenkonverter | A/D 24x12b | |
Core Size | 8-Bit | |
Core Prozessor | S08 | |
Konnektivitéit | CANbus, I²C, LINbus, SCI, SPI | |
Basis Produktnummer | MC9S08 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. MC9S08DZ60ACLH.
Produktiounsattriff | ||||
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Part Number | MC9S08DZ60ACLH | MC9S08DZ60AMLH | MC9S08DZ60AMLC | MC9S08DZ60CLC |
Hiersteller | NXP USA Inc. | NXP USA Inc. | Freescale Semiconductor | NXP USA Inc. |
Supplier Device Package | 64-LQFP (10x10) | 64-LQFP (10x10) | 32-LQFP (7x7) | 32-LQFP (7x7) |
RAM Gréisst | 4K x 8 | 4K x 8 | 4K x 8 | 4K x 8 |
Serie | S08 | S08 | S08 | S08 |
Peripheralien | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT |
Voltage - Versorgung (Vcc / Vdd) | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Datenkonverter | A/D 24x12b | A/D 24x12b | A/D 10x12b | A/D 10x12b |
Zuel vun I / O | 53 | 53 | 25 | 25 |
Programmspeichergréisst | 60KB (60K x 8) | 60KB (60K x 8) | 60KB (60K x 8) | 60KB (60K x 8) |
Speed | 40MHz | 40MHz | 40MHz | 40MHz |
EEPROM Gréisst | 2K x 8 | 2K x 8 | 2K x 8 | 2K x 8 |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
Core Prozessor | S08 | S08 | S08 | S08 |
Package protegéieren | Tray | Tray | Bulk | Tray |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) |
Oszilléierertyp | External | External | External | External |
Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
Konnektivitéit | CANbus, I²C, LINbus, SCI, SPI | CANbus, I²C, LINbus, SCI, SPI | CANbus, I²C, LINbus, SCI, SPI | CANbus, I²C, LINbus, SCI, SPI |
Package / Case | 64-LQFP | 64-LQFP | 32-LQFP | 32-LQFP |
Basis Produktnummer | MC9S08 | MC9S08 | MC9S08 | MC9S08 |
Eroflueden MC9S08DZ60ACLH PDF DataDhusts an NXP USA Inc. Dokumentatioun fir MC9S08DZ60ACLH - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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