IRF5802 Tech Spezifikatioune
Infineon Technologies - IRF5802 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Infineon Technologies - IRF5802
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Infineon Technologies | |
Vgs (th) (Max) @ Id | 5.5V @ 250µA | |
Vgs (Max) | ±30V | |
Technologie | MOSFET (Metal Oxide) | |
Supplier Device Package | Micro6™(TSOP-6) | |
Serie | HEXFET® | |
Rds On (Max) @ Id, Vgs | 1.2Ohm @ 540mA, 10V | |
Power Dissipation (Max) | 2W (Ta) | |
Package / Case | SOT-23-6 Thin, TSOT-23-6 |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Package protegéieren | Tube | |
Mounting Type | Surface Mount | |
Input Capacitance (Ciss) (Max) @ Vds | 88 pF @ 25 V | |
Gate Charge (Qg) (Max) @ Vgs | 6.8 nC @ 10 V | |
FET Typ | N-Channel | |
FET Feature | - | |
Fuert Volt (Max Rds On, Min Rds On) | 10V | |
Entworf fir Source Voltage (Vdss) | 150 V | |
Aktuell - Kontinuéierter Drain (Id) @ 25 ° C | 900mA (Ta) |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Infineon Technologies IRF5802.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | IRF5802 | IRF5803D2PBF | IRF541 | IRF5803D2TR |
Hiersteller | Infineon Technologies | Infineon Technologies | Harris Corporation | Infineon Technologies |
Technologie | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) |
Power Dissipation (Max) | 2W (Ta) | 2W (Ta) | 150W (Tc) | 2W (Ta) |
Fuert Volt (Max Rds On, Min Rds On) | 10V | 4.5V, 10V | 10V | 4.5V, 10V |
Gate Charge (Qg) (Max) @ Vgs | 6.8 nC @ 10 V | 37 nC @ 10 V | 59 nC @ 10 V | 37 nC @ 10 V |
Aktuell - Kontinuéierter Drain (Id) @ 25 ° C | 900mA (Ta) | 3.4A (Ta) | 28A (Tc) | 3.4A (Ta) |
Vgs (Max) | ±30V | ±20V | ±20V | ±20V |
Entworf fir Source Voltage (Vdss) | 150 V | 40 V | 80 V | 40 V |
Package / Case | SOT-23-6 Thin, TSOT-23-6 | 8-SOIC (0.154", 3.90mm Width) | TO-220-3 | 8-SOIC (0.154", 3.90mm Width) |
FET Typ | N-Channel | P-Channel | N-Channel | P-Channel |
Vgs (th) (Max) @ Id | 5.5V @ 250µA | 3V @ 250µA | 4V @ 250µA | 3V @ 250µA |
Input Capacitance (Ciss) (Max) @ Vds | 88 pF @ 25 V | 1110 pF @ 25 V | 1450 pF @ 25 V | 1110 pF @ 25 V |
FET Feature | - | Schottky Diode (Isolated) | - | Schottky Diode (Isolated) |
Mounting Type | Surface Mount | Surface Mount | Through Hole | Surface Mount |
Supplier Device Package | Micro6™(TSOP-6) | 8-SO | TO-220AB | 8-SO |
Serie | HEXFET® | FETKY™ | - | FETKY™ |
Package protegéieren | Tube | Tube | Bulk | Tape & Reel (TR) |
Rds On (Max) @ Id, Vgs | 1.2Ohm @ 540mA, 10V | 112mOhm @ 3.4A, 10V | 77mOhm @ 17A, 10V | 112mOhm @ 3.4A, 10V |
Eroflueden IRF5802 PDF DataDhusts an Infineon Technologies Dokumentatioun fir IRF5802 - Infineon Technologies.
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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